Sony Corporation

Seiji Fukae

Shinji Watanabe

Koji Miyata

Masakazu Baba

Shuji Yoneda

Masato Oishi

Tamotsu Shinohara

Kenji Yamauchi

Yoichi Goto

A semiconductor device having a substrate including a photodiode; a resin layer formed on an upper surface of the substrate, the resin layer not covering a light receiving region of the photodiode, the resin layer including at least one groove surrounding the light receiving region; and a molding resin portion formed by mold-sealing the photodiode with the resin layer thereon so as not to cover the light receiving region.

Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufacture

A method for manufacturing a semiconductor device, includes the steps of: forming a resin layer on an upper surface of a substrate including a photodiode such that the resin layer does not cover a light receiving region of the photodiode; forming at least one groove in the resin layer so as to surround the light receiving region; and subsequently mold-sealing the photodiode by loading the substrate into a mold and filling the mold with a molding resin.

Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufacture and method for manufacturing same

Growing community of inventors

Kagoshima, Japan

Seiji Fukae