Subaru Corporation

Disco Corporation

Kabushiki Kaisha Toshiba

Seiji Fujiwara

Kenichi Takeda

Hiroyuki Watanabe

Yasuo Takagi

Yoshiaki Yodo

Masahiko Yamada

Tsuneji Kameda

Kazuya Yamada

Kunimitsu Takahashi

Nobuyasu Kitahara

Hiroyuki Yamauchi

Yuko Kawajiri

Hisao Watanabe

Masato Yoshino

Junichi Kuki

Shigeo Kasai

Masafumi Komai

Chikara Aikawa

Takatoshi Asada

Hisao Oomura

Ryoji Yoshimura

Yosuke Hachisu

Shinichi Makino

Masashiko Yamada

A vehicle-body front structure includes a pair of left and right side frames, a cross member, a pair of sub-frames, projections, and buckling structures. The pair of left and right side frames extend in a front-rear direction. The cross member is coupled to a lower side of the pair of left and right side frames and extends in a left-right direction. The pair of sub-frames are coupled to a lower side of the cross member and extend in the front-rear direction. Each projection is disposed on a front end side of the corresponding sub-frame and projects from the corresponding side frame outward in the left-right direction in a plan view. Each buckling structure is formed in the corresponding sub-frame and causes the sub-frame to buckle such that the corresponding projection comes into contact with the cross member when an impact load is applied to the projection from a front side.

Vehicle-body front structure

A wafer processing method divides a wafer into a plurality of individual devices along a plurality of crossing division lines formed on the front side of the wafer. The method includes a functional layer removing step of applying a COlaser beam to the wafer along each division line with the spot of the COlaser beam, having a width corresponding to the width of each division line set on the upper surface of each division line, thereby removing a functional layer along each division line to form a groove along each division line where the functional layer has been removed, and a groove shaping and debris removing step of applying a laser beam having a wavelength in the ultraviolet region to the wafer along each groove, thereby removing debris sticking to the bottom surface of each groove and also shaping the side walls of each groove.

Wafer processing method

Growing community of inventors

Tokyo, Japan

Seiji Fujiwara