Boe Technology Group Co., Ltd.

Seiji Fujino

Xiaohu Wang

Guodong Huang

Tao Wang

Song Zhang

Dejiang Zhao

Jing Gao

Xiaobo Du

Rui Hong

Qinghui Zeng

Xiaolei Zhang

Dan Wang

Wei Cui

Hao Wang

Lu Wang

Zhuo Zhang

Xiangjun Tian

Jiangbo Wang

Changhai Feng

The embodiments of the present invention provide an encapsulation method, a display panel and a display device. The encapsulation method includes: forming a first room temperature bonding layer on the encapsulation region of the array substrate, an OLED device is formed on the display region of the array substrate; forming a second room temperature bonding layer on the encapsulation region of the heat diffuser plate; vacuum laminating the array substrate and the heat diffuser plate such that the first room temperature bonding layer and the second room temperature bonding layer contact with each other and form a sealed structure. The encapsulation method omits the existing encapsulation substrate by using room temperature bonding technology to encapsulate the heat diffuser plate and the array substrate, therefore can not only reduce the overall thickness of the display panel but also further improve the heat dissipation effect.

Encapsulation method, display panel and display device

The present disclosure provides an evaporation device and an evaporation method using the evaporation device. The evaporation device includes a main chamber with an internal space and an evaporation mechanism under the main chamber. The evaporation mechanism includes at least two crucible accumulation chambers. The evaporation mechanism is configured to be operated in a first state where a first crucible accumulation chamber is at an evaporation position and in communication with the main chamber to form a vacuum space, and evaporation of a material in the crucible in the first crucible accumulation chamber is performed, and in a second state where, in a vacuum environment, the first crucible accumulation chamber is moved away from the evaporation position and a second crucible accumulation chamber is moved to the evaporation position and in communication with the main chamber.

Evaporation device and evaporation method using the same

An evaporation source includes a heat source structure and an evaporation container for accommodating a to-be-evaporated material. The heat source structure includes a heat source and a thermal conductor. The thermal conductor is in contact with the evaporation container, and the heat source is at the thermal conductor and around the evaporation container.

Evaporation source and evaporation device

A laser packaging method and a manufacturing method of a display panel are provided. The laser packaging method includes placing a first substrate () on a platform (), and arranging a glass frit in a packaging region of the first substrate (); cell-assembling a second substrate () and the first substrate (); and pre-heating the first substrate () and the second substrate () which are cell-assembled.

Laser packaging method and manufacturing method of display panel

The present invention provides a glass powder blend comprising glass powder and additives, wherein the additives comprise copper powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass %. The present invention also provides a glass powder paste and a photoelectric package. Due to the addition of copper powder to the glass powder, the melting point of the glass powder blend can be decreased, thereby lowering the temperature for melting the glass powder blend by using laser, and reducing the thermal stress generated during encapsulation.

Glass powder blend, glass powder paste and photoelectric package

The present disclosure provides a mask plate, a mask exposure device and a mask exposure method, belongs to the field of display technology. The mask plate includes a tray with at least one mask locating slot, and a mask is arranged in each mask locating slot. By the mask plate, the mask exposure device and the mask exposure method provided by the present disclosure, an effective mask with a closed-loop shaped opening may be provided, thereby improving a quality of a film formed on a substrate.

Mask plate, mask exposure device and mask exposure method

The present invention discloses a packaging apparatus and a packaging device. The packaging apparatus comprises a mask plate and a control circuit that is electrically connected to the mask plate and is used to control the mask plate such that the mask plate electrostatically adsorbs a first substrate or release the first substrate. In the technical solutions of the present invention, the mask plate is controlled by the control circuit such that the mask plate electrostatically adsorbs or releases the first substrate without the need to use the alignment mechanism of mechanical fixing type to fix the first substrate. By completely adsorbing the first substrate by the mask plate in a way of electrostatic adsorption, the deformation of the first substrate and the generation of bubbles between the first substrate and the second substrate are avoided, the alignment precision is improved, and the slip-off of the first substrate from the mask plate during the process of pressing is avoided.

Packaging apparatus and packaging device

An array substrate and manufacturing method thereof, display panel and display device are disclosed. The array substrate includes a display region and a packaging region surrounding the display region. The packaging region is provided with a packaging planarization layer, the packaging planarization layer includes a plurality of packaging planarization units, and each of the packaging planarization units is formed as a ring shaped pattern in the packaging region and configured to surround the display region.

Array substrate and manufacturing method thereof, display panel and display device

An evaporation coating apparatus comprising a heating unit () and a cylindrical member () disposed within the heating unit (), wherein the cylindrical member () comprises a hollow sleeve () and a barrel () disposed at an inner side of the hollow sleeve () in a fitting manner; wherein a top end area of the hollow sleeve () is provided with a first evaporation hole (), and an external surface of the hollow sleeve () is provided with an internal heater strip () connected to a control unit; wherein an external surface of the barrel () is provided with a groove (') extending along an axial central line of the barrel (), the groove (&#x2032;) is provided with a plurality of compartments () arranged at interval space, and each of the compartments () is provided with a crucible (); wherein the crucible () comprises a main body () which is disposed within the compartment () and sealed all around with one side opened, and a cover () which is connected to the main body () in a fitting manner and provided with a second evaporation hole () corresponding to the first evaporation hole (); and wherein the heating unit () has a hollow columnar structure, and an external surface of the heating unit () is provided with an external heater strip () and a nozzle () which is corresponding to the first evaporation hole (). The evaporation coating apparatus is mainly configured to manufacture large-sized displays and can improve the uniformity of film-forming with organic material on the surface of the substrate.

Evaporation coating apparatus

Embodiments of the present disclosure provide a method for producing a mask and a mask obtained by this method. The mask is configured to shield light during an exposure of a product. The method includes steps of: producing a composite membrane, wherein the composite membrane includes a first protection layer, a bonding layer, a shielding layer and a second protection layer stacked in sequence; only cutting the first protection layer, the bonding layer and the shielding layer of the composite membrane, wherein a cutting line corresponds to a shape of an area to be exposed of the product; removing the first protection layer and cut portions of the bonding layer and the shielding layer which have a same shape as that of the area to be exposed; attaching the formed composite membrane onto a base substrate of an open mask, and removing the second protection layer.

Method for producing a mask and the mask

Discloses is a packaging equipment, a method for using the same, and a computer readable storage medium. The packaging equipment includes a movable mechanism and a package assembly, and the movable mechanism is configured to drive the package assembly to move along a predetermined path. The package assembly includes a first rotating mechanism and a first functional module disposed along a first axis, a second functional module is disposed on the first rotating mechanism, and the first rotating mechanism is configured to drive the second functional module to rotate around the first axis.

Packaging equipment, method for using the same, and computer readable storage medium

A plasma generator, a plasma annealing device, a deposition crystallization apparatus and a plasma annealing process are disclosed. The plasma generator includes: a gas chamber; a gas intake member configured to introduce a gas into the gas chamber; a cathode and an anode that are configured to apply an electric field to the gas introduced into the gas chamber to ionize the gas into plasma; a cooling water circulation member configured to control a temperature of the plasma generator; and a plasma beam outlet disposed on a top face of the gas chamber. The plasma annealing device including the plasma generator can generate a plasma beam, which can be used in annealing to amorphous silicon and crystallize the amorphous silicon to polycrystalline silicon.

Plasma generator, annealing device, deposition crystallization apparatus and annealing process

A composition for packaging an electronic device comprises a matrix and an adsorption material having a water vapor adsorption capability, and the adsorption material includes attapulgite and/or zeolite. By adding attapulgite and/or zeolite which have an adsorption effect to modify the formulation of the frit, the compositions for packaging an electronic device can effectively reduce the influence of water vapor on the electronic device, thereby effectively extending the lifetime of the packaged electronic device.

Composition for packaging electronic device, packaging method, and OLED display apparatus

A thin film transistor, an array substrate and a display device are disclosed, the thin film transistor comprises a gate electrode, an active layer located on the gate electrode, and a source electrode and a drain electrode respectively located at opposite sides of the active layer and both partially overlapped with the active layer; the active layer includes at least one first structure part and at least one second structure part, a material for the first structure part is semiconductor, and a material for the second structure part is predetermined conductor, and the predetermined conductor has better conductivity than the conductivity of the conducted semiconductor, and in response to that a turn-on voltage is applied to the gate electrode, a conductive passage located between the source electrode and the drain electrode includes the first structure part and the second structure part.

Thin film transistor, array substrate and display device

A packaging method for an organic light emitting display panel, an organic light emitting display panel and a display device are disclosed. The packaging method includes: forming a water/oxygen blocking layer that covers a whole base substrate on the base substrate with an organic light emitting device and a peripheral bonding region formed thereon, etching the water/oxygen blocking layer on the base substrate, so as to at least remove the water/oxygen blocking layer on a connection terminal within the bonding region, and to retain the water/oxygen blocking layer on the organic light emitting device. With the packaging method, an organic light emitting display panel with a narrow frame can be realized.

Growing community of inventors

Beijing, China

Seiji Fujino