Japan Cash Machine Co., Ltd.

Seiji Asakawa

Katsutoshi Okawa

A document photosensor is provided which comprises a substrate, a bracketdisposed on substratefor forming a light diffusion chamberand a light receiving chamberseparated from each other, an LED chipsurface-mounted on substratein light diffusion chamber, and a PD chipsurface-mounted on substratein light receiving chamber. These chipsandare secured at precise locations on a substrateandwith accuracy on the order of a few micrometers or less to exactly detect by PD chipa light irradiated from LED chiporafter reflection of the light on a billmoved along a passagewayto improve validation performance of bill

Document photosensor of surface-mounted elements

A document photosensor is provided which comprises upper and lower sensor assembliesanddisposed on opposite sides of a passagewayalong which a documentis transported. Upper sensor assemblycomprises an upper substratean upper LED chipsurface-mounted on upper substrateand an upper PD chipsurface-mounted on upper substrateLower sensor assemblycomprises a lower substratea lower LED chipsurface-mounted on lower substrateand a lower PD chipsurface-mounted on lower substrateThese chipsandare secured at precise locations on upper and lower substratesandwith accuracy on the order of a few micrometers or less to exactly detect by upper and lower PD chipslights irradiated from upper and lower LED chipsandafter penetration of these lights through particular points on a billmoved along passagewayto improve validation performance of bill

A document photosensor is provided which comprises upper and lower sensor assembliesanddisposed on opposite sides of a passagewayalong which a documentis transported. Upper sensor assemblycomprises an upper substrate, an upper LED chipsurface-mounted on upper substrateand an upper PD chipsurface-mounted on upper substrate. Lower sensor assemblycomprises a lower substrate, a lower LED chipsurface-mounted on lower substrateand a lower PD chipsurface-mounted on lower substrate. These chipsandare secured at precise locations on upper and lower substratesandwith accuracy on the order of a few micrometers or less to exactly detect by upper and lower PD chipslights irradiated from upper and lower LED chipsandafter penetration of these lights through particular points on a billmoved along passagewayto improve validation performance of bill

Growing community of inventors

Tokyo, Japan

Seiji Asakawa