Screen Holdings Co., Ltd.

Seiji Ano

Toru Edo

Nobuyuki Shibayama

Jun Sawashima

Takayoshi Tanaka

Hiroki Tsujikawa

Naozumi Fujiwara

Masayuki Hayashi

Tomonori Kojimaru

Keiji Iwata

Shotaro Tsuda

Yuji Sugahara

A static eliminator performs processing of reducing the charge amount of an electrically charged substrate. The static eliminator includes a substrate holder and an ultraviolet irradiator. The substrate holder holds the substrate. The ultraviolet irradiator is capable of irradiating a main surface of the substrate with ultraviolet light in an irradiation amount that differs between a plurality of divided regions of the main surface of the substrate.

Static eliminator and static eliminating method

A substrate processing method is provided, which includes: an ozone-containing hydrofluoric acid solution spouting step of spouting an ozone-containing hydrofluoric acid solution containing ozone dissolved therein from a nozzle toward one major surface of a substrate held by a substrate holding unit; and a brush-cleaning step of cleaning the one major surface of the substrate by bringing a cleaning brush into abutment against the one major surface of the substrate, the brush-cleaning step being performed after the ozone-containing hydrofluoric acid solution spouting step or in parallel with the ozone-containing hydrofluoric acid solution spouting step.

Substrate processing method and substrate processing device

A substrate treatment method is used for removing a resist from a front surface of a substrate. A substrate treatment apparatus includes a substrate holding unit which holds the substrate, and a sulfuric acid ozone/water mixture supplying unit which supplies a sulfuric acid ozone/water mixture to the front surface of the substrate held by the substrate holding unit, the sulfuric acid ozone/water mixture being a mixture which is prepared by a method including mixing water with sulfuric acid ozone prepared by dissolving ozone gas in sulfuric acid.

Substrate treatment apparatus and substrate treatment method

A substrate processing apparatus includes a rotating holder for a substrate, a first nozzle used to eject a jet flow, a second nozzle used to discharge a continuous flow, and a nozzle moving unit integrally moving the first and second nozzles. A landing position of the continuous flow is located closer to a rotation center than a landing position of the jet flow is. At least movement paths of the landing positions of the jet flow and the continuous flow or flow directions of the continuous flow and the jet flow are different from each other. The movement paths are made to be different from each other by locating the landing position of the continuous flow downstream of the movement path of the landing position of the jet flow. The flow directions are made to be different from each other by tilting the continuous flow.

Substrate processing apparatus and substrate processing method

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Kyoto, Japan

Seiji Ano