Ube Industries, Inc.

Ntn-Rulon Industries, Ltd.

Seiichirou Takabayashi

Tooru Murakami

Hiroshi Inoue

Tetsuji Hirano

Takeshige Nakayama

Akihiro Kunimoto

Koji Hayashi

Kazuaki Mii

Masaki Egami

Kenichiro Yano

Mitsuo Yamanaka

Takafumi Hirakawa

Tadao Muramatsu

Tomonori Nakayama

Katsuo Imatani

Susumu Takasaki

Kenji Sonoyama

Yoshiki Tanaka

Katsutoshi Hirashima

Nobuhiro Shigetomi

Tomoko Hayashida

Hiroo Yamashita

Shuji Watakabe

Tsutomu Funagoshi

Tadao Muramatu

Morio Nakamura

Tatuaki Maeda

The present invention relates to a binder resin composition for an electrode, including a polyamic acid and a solvent, wherein the polyamic acid is (i) a polyamic acid which includes a tetracarboxylic acid component including 10 to 100 mol % of 4,4'-oxydiphthalic acid and 90 to 0 mol % of 3,3&#x2032;,4,4&#x2032;-biphenyltetracarboxylic acid and/or pyromellitic acid and a diamine component including an aromatic diamine having 1 to 4 aromatic rings, (ii) a polyamic acid which includes a tetracarboxylic acid component including 3,3&#x2032;,4,4&#x2032;-biphenyltetracarboxylic acid dianhydride and a diamine component including 10 to 90 mol % of p-phenylene diamine and 90 to 10 mol % of 4,4&#x2032;-diaminodiphenyl ether, or (iii) a polyamic acid which includes a tetracarboxylic acid component including 3,3&#x2032;,4,4&#x2032;-biphenyltetracarboxylic acid dianhydride and a diamine component including 40 mol % or more of a bis[4-(4-aminophenoxy)phenyl] compound.

Binder resin composition for electrode, electrode mixture paste, and electrode

In a first step, a diamine is reacted with a molar excess of a tetracarboxylic dianhydride in a solvent containing more than &#x2153; mole of water per mole of the tetracarboxylic dianhydride, whereby preparing a polyamic acid solution. Subsequently, in a second step, a diamine and/or a tetracarboxylic dianhydride are added to the polyamic acid solution obtained in the first step so that the molar amount of the diamine component is substantially equal to the molar amount of the tetracarboxylic acid component, and then the diamine and the tetracarboxylic dianhydride are reacted, whereby preparing a polyamic acid solution. By this process, a polyamic acid solution having a high concentration and a low viscosity may be reproducibly and reliably produced, while controlling the molecular weight of the polyamic acid to a predetermined low level.

Process for producing polyamic acid solution and polyamic acid solution

There may be provided a process for producing a polyimide siloxane solution composition having a further improved long-term viscosity stability; and a polyimide siloxane solution composition. In the process for producing the polyimide siloxane solution composition by polymerizing/imidizing a tetracarboxylic acid component and a diamine component consisting of (a) a diaminopolysiloxane, (b) a diamine having a polar group and (c) a diamine other than (a) and (b) in a solvent, the tetracarboxylic acid component and the diamine component excluding (b) the diamine having a polar group are polymerized/imidized to provide a reaction mixture solution, and then (b) the diamine having a polar group is added to the reaction mixture solution last, and the mixture is polymerized/imidized.

Process for producing polyimide siloxane solution composition, and polyimide siloxane solution composition

Disclosed is a method for producing a polyimide film, wherein a polyamic acid solution composition is coated on a base material and the resultant coating film is processed by heat treatment; the polyamic acid solution composition is obtained by introducing a specific chemical structure into a polyamic acid at a ratio within a specific range; and the polyamic acid has a chemical structure composed of a 3,3',4,4&#x2032;-biphenyltetracarboxylic acid component and/or a pyromellitic acid component, and a paraphenylenediamine component. Also disclosed is the polyamic acid solution composition.

Method for producing polyimide film and polyamic acid solution composition

Disclosed is a process for producing a polyamic acid solution by reacting a diamine component consisting essentially of 20 mol % to 80 mol % of p-phenylenediamine and 80 mol % to 20 mol % of diaminodiphenyl ether with a tetracarboxylic acid component consisting essentially of 10 mol % to 60 mol % of 2,3,3',4&#x2032;-biphenyltetracarboxylic dianhydride and 90 mol % to 40 mol % of 3,3&#x2032;,4,4&#x2032;-biphenyltetracarboxylic dianhydride in a solvent, comprising:

A process for producing a pigment-containing curable resin solution composition which comprises a pigment and a modified polysiloxane is disclosed. The process comprises the steps of: (a) preparing a pigment-dispersed liquid, wherein a pigment is dispersed in an organic solvent in the presence of a first modified polysiloxane; and (b) mixing the pigment-dispersed liquid with a resin solution which comprises at least a second modified polysiloxane. This process provides a pigment-containing curable resin solution composition with excellent dispersion stability of pigment.

Process for producing pigment-containing curable resin solution composition, pigment dispersed liquid, and pigment-containing curable resin solution composition

[PROBLEMS] To provide a polyimidesiloxane solution composition that is excellent in defoaming ability and that can maintain the wettability of an outer lead bonded portion on a wiring board at a high level, even when it is applied on the surface of the wiring board and then cured, to form an insulating cured film. [MEANS FOR SOLVING PROBLEMS] A polyimidesiloxane solution composition which comprises an organic solvent, polyimidesiloxane soluble in the organic solvent, a curable components such as an epoxy compound and a polyvalent isocyanate compound, and a silicone defoamer, wherein the silicone defoaming agent comprises dimethylpolysiloxane, a polysiloxane compound having a hydrophilic group in a side chain or a terminal moiety, and a micro-powder silica.

Polyimidesiloxane solution composition

An adhesive polyimide composition comprises 100 weight parts of a polyimide siloxane having a Tg of not lower than 200.degree. C. and 0.2 to 5 weight parts of a silane coupling agent having a glycidyl group. An epoxy resin may be incorporated into the polyimide composition. The polyimide siloxane is prepared by polymerization reaction of an aromatic tetracarboxylic acid dianhydride or its derivative and a diamine composition comprising 5 to 25 mol. % of a specific diaminosiloxane and 75 to 95 mol. % of an aromatic diamine having at least two benzene rings and one oxygen atom intervening these benzene rings. The adhesive polyimide composition is generally employed in the form of a solution in an organic solvent and for combining electrically conductive or insulating members.

Adhesive polyimide siloxane composition employable for combining

An aromatic polyimide film directly laminated with a metal foil and an aromatic polyimide film directly laminated on both sides with a metal foil wherein the polyimide film (substrate) comprises an aromatic polyimide layer-A of 6-200 .mu.m thick whose polyimide is derived from a biphenyltetracarboxylic acid or its derivative and a phenylenediamine and an aromatic polyimide layer-B of 0.2-15 .mu.m thick whose polyimide is derived from an aromatic tetracarboxylic acid or its derivative and an aromatic diamine having plural benzene rings, and the polyimide layer-A has a thickness of not less than 55% of the total thickness of the aromatic polyimide substrate film, the polyimide layer-B is fixed to the polyimide layer-A under the condition that the layer-B cannot be peeled from the layer-A along the interface between these layers-A and -B and the metal foil is directly fixed on the surface of the polyimide layer-B via no adhesive.

Aromatic polyimide film laminated with metal foil

The disclosed heat resistant adhesive composition comprises a polyimidesiloxane obtained from a biphenyltetracarboxylic acid or its derivative and a diamine composition comprising a diaminopolysiloxane and an aromatic diamine, an epoxy compound having an epoxy group, and an epoxy compound-hardening agent. An adhesive film and a composite sheet utilizing the heat resistant resinous composition are also disclosed.

Heat resistant adhesive composition

A process for preparing a metallized polyimide film, comprising the steps of: forming a solidified film containing 100 parts by weight of an aromatic polyamic acid in the form of a solution obtained by polymerizing approximately equal moles of an aromatic tetracarboxylic acid component and an aromatic diamine component and 5 to 150 parts by weight of an organic polar solvent; applying a surface treatment solution containing a heat-resistant surface treating agent to the surface of the solidified film; heating the solidified film to a high temperature to imidize the polyamic acid, while drying the film to prepare a polyimide film; forming a thin metal vapor-deposited layer by a vapor deposition of a metal on the treated surface of the polyimide film with the heat-resistant surface treatment agent; and applying metal plating onto the metal vapor deposited layer to form a metal plated layer thereon.

Process for preparing metallized polyimide film

An extruded porous article, which can be prepared by a ram-extruding method, comprising an aggregated aromatic polyimide powder which has a heat loss ratio of not more than 2 wt. %, the heat loss ratio being measured at 360.degree. C. for 1 hour, and a mean particle size in the range of 1 to 40 .mu.m, wherein pores are distributed essentially uniformly in the article, and its porosity is in the range of 5-20%, the porosity % being defined by the formula: ##EQU1##

Extruded porous articles of polyimide and continuous preparation of the

A shaped electroconductive aromatic imide polymer article comprising an aromatic imide polymer matrix and 10% to 40% by weight of short cut carbon fibers 1 to 30 .mu.m thick and 0.05 to 3.0 mm long dispersed in the matrix, is produced by admixing a slurry of the short cut carbon fibers having a limited moisture content of 1.0% or less in a polymerization medium, with a polymerization mixture containing an aromatic tetracarboxylic acid component and an aromatic diamine component, by subjecting the resultant admixture to a polymerization procedure to prepare a dope comprising a resultant polymerization product, the carbon fibers and the polymerization medium, and by subjecting the dope to shaped article-producing procedures in which the dope is shaped into a desired form and the shaped dope is solidified by removing the polymerization medium to provide a desired shaped article.

Shaped electroconductive aromatic imide polymer article and process for

An abrasive sheet having an excellent flexibility, mechanical strength and heat resistance comprises an aromatic imide polymer matrix and abrasive particles having an average size of 0.1 to 50 .mu.m and is prepared by evenly dispersing the abrasive particles in an organic polar solvent, mixing the resultant dispersion with a polymerization mixture consisting of an acid component comprising, as a major acid ingredient, a biphenyltetracarboxylic acid or an dianhydride thereof with a diamine component comprising an aromatic diamine, while polymerizing the acid and diamine components at 0.degree. C. to 80.degree. C. into an aromatic polyamic acid, forming the resultant dope dispersion into a thin layer and solidifying the thin layer while imidizing the aromatic polyamic acid into a corresponding aromatic imide polymer.

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Ube, Japan

Seiichirou Takabayashi