Daiwa Fine Chemicals Co., Ltd.

Other

Sumitomo Electric Industries, Limited

Nippon Steel Corporation

Vallourec Oil and Gas France

Nippon Beet Sugar Manufacturing., Co., Ltd.

Nippon Steel Sumitomo Metal Corporation

Seiichiro Nakao

Keigo Obata

Masatoshi Majima

Shinji Inazawa

Takao Takeuchi

Yoshiaki Okuhama

Masakazu Yoshimoto

Ayao Kariya

Shigeyoshi Nakayama

Hidenori Tsuji

Shingo Kitamura

Dong-Hyun Kim

Kunio Goto

Tatsuya Yamamoto

Masanari Kimoto

Kazuya Ishii

Hidemi Nawafune

Masahiro Oshima

Hideaki Yamada

Daisuke Yamaguchi

Kim Dong Hyun

Osamu Masuyama

Takuya Nakagawa

Yasuomi Ota

The invention is to provide a base paper for a raising seedling pot and a raising seedling pot produced from the base paper, wherein while the base paper maintains a sufficient strength during raising seedlings and planting in the field, it is degraded over time by soil microorganisms after transplanting in the field and is produced by using a crosslinking agent that does not contain formaldehyde, resulting in a reduced burden on the environment; the base paper for a raising seedling pot, wherein a citric acid crosslinking agent, as a crosslinking agent for cellulose, is used in order to block the hydroxy group of cellulose in paper through crosslinking; and the raising seedling pot produced by molding and processing the base paper.

Decay-resistant paper

Provided is a plating solution for a threaded connection used for forming a plating film excellent in galling resistance, crevice corrosion resistance, and exposure corrosion resistance. The plating solution contains no cyanide, but contains copper pyrophosphate, tin pyrophosphate, zinc pyrophosphate, pyrophosphate as a metal complexing agent, and a sulfur-containing compound of 40 g/L or less (excluding 0). The sulfur-containing compound includes: a mercapto compound and a sulfide compound defined by Chemical Formula (1); a dimer formed through a disulfide bond of the mercapto compounds; and one or more types of salts thereof:RS&#x2014;(CHX)&#x2014;(CHX)&#x2014;CHXX&#x2003;&#x2003;(1),

Plating solution for threaded connection for pipe or tube and producing method of threaded connection for pipe or tube

A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (III): (I) silver colloidal particles, (II) one or more ions selected from an ion of a metal having an electric potential which can reduce a silver ion to metal silver in the solution and an ion oxidized at the time of reduction of the silver ion, and (III) one or more ions selected from a hydroxycarboxylate ion, a condensed phosphate ion and an amine carboxylate ion, the silver colloidal particles (I) being produced by the ion of the metal (II) having an electric potential which can reduce a silver ion to metal silver. When an object to be plated is pretreated by use of the pretreatment solution, provision of an effective catalyst for electroless plating is achieved.

Pretreatment solution for providing catalyst for electroless plating, pretreatment method using the solution, and electroless plated film and/or plated object produced by use of the method

A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver colloidal solution is used containing as essential components at least the following: (I) silver colloidal particles; (II) one or more of ions of metal having an electric potential which can reduce silver ions to metal silver in the solution and/or ions which result from oxidation of the ion at the time of reduction of the silver ions; and (III) one or more of hydroxycarboxylate, condensed phosphate and/or amine carboxylate ions. The silver colloidal particles (I) are produced by the ion (II) of the metal having an electric potential which can reduce silver ions to metal silver. The circuit pattern may be formed on a printed wiring board.

Method for forming circuit pattern

To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Plating method and plating bath precursor used therefor

Redox system electroless plating method

Growing community of inventors

Akashi, Japan

Seiichiro Nakao