Matsushita Electric Industrial Co., Ltd.

Seiichiro Mori

Eiji Ohno

Masahide Yokoyama

Hiroshi Hayata

Toshiyuki Suemitsu

A magnetron sputtering apparatus has a plurality of ring-shaped flat targets with different diameters disposed about one center axis. The apparatus includes magnets having the same polarity as each other and placed on both front surface side and rear surface side of each of the targets along an inner circumferential edge thereof, and magnets having the same polarity as each other and placed on both front surface side and rear surface side of each of the targets along an outer circumferential edge thereof. The magnets placed along the inner and outer circumferential edges are placed in such a way that the magnets along the inner circumferential edge and the magnets along the outer circumferential edge become opposite in polarity to each other.

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Neyagawa, Japan

Seiichiro Mori