Fuji Machine Mfg. Co., Ltd.

Seiichi Terui

Koichi Asai

Kunio Oe

Kouji Shimizu

Takehisa Ishikawa

A component mounting apparatus includes two board transfer devices each for transferring boards, at least one component supply device for supplying plural kinds of components to be mounted on the boards, and a component placing device including at least one component placing head for picking up the supplied components to mount the picked-up components on the boards and at least one head moving mechanism for moving the at least one component placing head in at least two directions parallel to a surface of the board. The apparatus also includes a controller that operates one component placing head to mount components alternately on two boards transferred by the two board transfer devices to respective component mounting positions and operates two component placing heads to mount components in parallel on two boards transferred by the two boards transfer devices to the respective component mounting positions.

System for mounting components on boards

A component mounting apparatus includes two board transfer devices, a component supply unit, a component placing device, a setting unit, and a controller. Until production of the urgent boards is instructed, the two board transfer devices and the component placing device mount components on the regular boards in accordance with a first mounting program stored by the controller. When production of the urgent boards is instructed, a regular board is unloaded from the other board transfer device, which has been set by the setting unit to transfer urgent boards, the transfer way width of the other board transfer device is adjusted to the width of the urgent boards, and the other board transfer device and the component placing device are controlled so that component mountings on the urgent boards are performed on the other board transfer device in accordance with a second mounting program stored by the controller.

A tray component supply apparatus comprises a main body side replenishment tray holding section 50 provided at an upper part over a tray stocker 40 of an apparatus main body 30 and a tray discharge section 60 provided at a lower part under the tray stocker 40 of the apparatus main body 30. The tray stocker 40 is provided with a tray stocker side replenishment tray holding section 80 on a top plate 44 thereof and empty tray holding members 85 on a bottom plate 43 thereof.

Tray parts feeder

A method of supplying suction nozzles with electric components supplied from feeders each of which is operable to feed the electric components to its component-supply portion and which are arranged in a direction intersecting a direction of feeding of the components, the suction nozzles being held by nozzle holders supported by a movable member and arranged in the direction arrangement of the feeders, the movable member being movable to permit each suction nozzle to hold the component by suction, wherein a distance between axes of adjacent ones of the selected suction nozzles in the direction of arrangement of the feeders is adjusted, and/or a component-supply position of each feeder at which the component is located after each feeding action of the feeder is adjusted, so that the selected suction nozzles are aligned with the components at the component-supply positions, and the selected suction nozzles are operated to simultaneously hold the components located at the component-supply positions. Also disclosed is an electric-component mounting system operable to practice the method and mount the electric components on a circuit substrate.

Electric-component supplying method and electric-component mounting system

An electric-component mounting system including component-mounting devices arranged in an array and each having a component-holding head for holding an electric component, and a head-moving device to move the head, and a substrate-transferring device to move at least one substrate on which electric components are to be mounted, and wherein the substrate-transferring device stops each substrate at at least one stop position which corresponds to at least one of the component-mounting devices and at which operations of the component-mounting devices are concurrently performed on the at least one substrate. The substrate-transferring device includes a first transferring device to move each substrate along a path parallel to the array of the component-mounting devices and stop each substrate at least once during its movement along the path, and a second transferring device having a substrate-holding device to hold each substrate at each stop position and a holding-device moving device to reciprocate the substrate-holding device by a maximum distance smaller than a maximum distance of movement of each substrate by the first transferring device, so that each substrate is moved together with the substrate-holding device.

Electric-component mounting system including movable substrate-holding device

A mounting head, a mounting apparatus, and a mounting method which are capable of contacting an electronic component with a substrate with a small contact load and mounting the component on the substrate, are provided. A suction device 120 is fit on a splined axis portion 118 of a support shaft 84 via a ball spline 126, is biased downward by a first spring 130, and is biased upward by a second spring 134. A suction nozzle 124 is attached to a nozzle holder 122 by engaging engagement ridges 172 of sheet springs 166 fixed to the suction nozzle 124 with engagement grooves 144 of the nozzle holder 122, respectively. Prior to the mounting of electronic components 178, a relationship between contact load and position of lift 28 is obtained, and a position to which the lift 28 is moved downward for mounting each electronic component 178 is pre-determined. Thus, each component 178 is contacted with a printed circuit board with an appropriate load. Each component 178 is contacted with the circuit board with a small load, by removing the self weight of the suction device 120 owing to the biasing action of the second spring 134 and reducing the frictional resistance produced between the suction device 120 and the axis member 84 owing to the provision of the ball spline 126.

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Chiryu, Japan

Seiichi Terui