Tdk Corporation

Seiichi Tajima

Takaaki Morita

Takashi Kariya

Takahito Kiriyama

Seiko Komatsu

Akira Suzuki

Kenichi Kawabata

Shuichi Takizawa

Hiroki Hara

Shigeru Asami

Wakiko Sato

Ikuo Katoh

Masumi Kameda

Bunji Moriya

Shinichiro Hayashi

Shigeru Sakano

Fumikachi Kurosawa

A multilayer board insulating sheet contains a reducing agent.

Multilayer board insulating sheet, multilayer board, and method of manufacturing multilayer board

A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board

A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.

Device-embedded board and method of manufacturing the same

In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.

Printed wiring board and method for manufacturing the same

In a wiring base body of a printed wiring board, a conductive post including a wiring portion and a wiring are embedded in an insulating resin film. Therefore, even in a region in which a wiring portion is formed, the wiring base body is not increased in thickness. In addition, even in a region in which a wiring is formed, the wiring base body is not increased in thickness. Therefore, it is possible to obtain a printed wiring board having high flatness by stacking a plurality of wiring base bodies and constituting a printed wiring board.

An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.

Electronic circuit module component and method of manufacturing electronic circuit module component

In a method of manufacturing an electronic device, an electronic component and a mount substrate are disposed such that one of surfaces of the electronic component faces toward one of surfaces of the mount substrate, and a connection electrode of the electronic component is electrically connected and mechanically bond to a patterned conductor of the mount substrate. A resin film is then disposed on the electronic component and the mount substrate. A gas captured in between the resin film and the electronic component is sucked through a hole provided in the mount substrate from a side of the mount substrate opposite to the electronic component. The resin film is thereby deformed to closely contact the electronic component and the mount substrate. The resin film is then heated and adhered to the mount substrate.

Electronic device and manufacturing same

A method for manufacturing a piezoelectric component in which a resonating portion on a piezoelectric substrate is provided with a deposit that is sensitive to radiation in a range of wavelengths from 350 to 2000 nm so as to have portions thereof trimmed away to form indentations therein without burning the deposit to avoid generating heat that is injurious to the piezoelectric component and substrate. A laser beam in the frequency range of 350 to 2000 nm is then caused to impinge on the deposit to cause the formation of trimmed indentations without substrate damaging heat in a controlled manner to adjust the resonance frequency of the piezoelectric component.

Manufacturing method for a piezoelectric component

The invention is directed to piezoelectric device having a vibration space that achieves a high degree of airtightness which is not readily reduced, and a manufacturing method thereof. First and second hollow layers are formed at first and second surfaces of a piezoelectric substrate to form first and second cavities around first and second electrodes respectively. The first and second cavities each have a uniform width and extend between a first surface and an opposing second surface of the first and second hollow layers respectively, around vibration portions of the piezoelectric element. First and second sealing layers are each formed on the second surface of the first and second hollow layers to seal the first and second cavities.

Piezoelectric device with sealed vibration space and manufacturing method thereof

A piezoelectric component having resonance characteristics adjusted to a high degree of accuracy is provided. A piezoelectric substrate is provided with a resonating part. A deposit is added onto a surface of the resonating part and is provided with a plurality of indented portions at its surface enclosed by outer edges. The deposit is constituted of a resin which may contain a carbon filler. The indented portions are formed through laser machining.

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Tokyo, Japan

Seiichi Tajima