Citizen Watch Company, Ltd.

Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Seiichi Mimura

Shingo Ichikawa

Yoshihiro Shimada

Isao Yabe

Yoshihiro Ishida

Katsuji Komatsu

Kikuo Takenouchi

Hirokazu Nishida

Takafumi Kawasaki

Kazuo Kobayashi

Yasuhiro Yoshida

Hiroshi Ohnishi

Hiroyuki Kaneko

Takao Mizutani

Atsuhiro Fujii

Yoshio Kasuga

Yasuhiko Horie

Kouichi Takamune

Hisashi Tominaga

Hidenobu Ito

Junichiro Shimizu

Masayuki Ohi

Takayuki Tajiri

Yoshiyuki Hatsutori

Masayuki Hamayasu

Hirozoh Tsuruta

To provide a multi-wire saw that, at the start of cutting of an ingot, prevents a wire from being displaced in grooves of guide rollers due to the wire being lifted. A wire is wound around a plurality of wire guide rollers to be positioned in a feeding direction of an ingot, and in this state, a wire-lifting restraining member that is a body of rotation and restrains the wire from being lifted by being brought into contact with the wire is disposed near the wire guide rollers.

Multi-wire saw and method for cutting ingot

The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 25 to 55% by mass, based on a total mass of components of the slurry excluding the abrasive powder.

Slurry for slicing silicon ingot and method for slicing silicon ingot using the same

A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.

Multi-wire saw

A thrust converter includes reciprocation movement means reciprocation-rotation conversion means for converting reciprocating movement of the reciprocation movement means into rotational movement; rotation-reciprocation conversion means for converting rotational movement of the reciprocation-rotation conversion means; and reaction-force receiving means for supporting reaction force stemming from reciprocation movement of the rotation-reciprocation conversion means. Thrust imparted to the reciprocation movement means can be imparted to a load while being amplified or reduced, through employment of a compact and simple construction.

Thrust converter, method of controlling the same, and controller for controlling the same

It is an object to improve the corrosion resistance of a CVD jig made of quartz to prevent exfoliation of a film attached on the surface to prevent dust. The surface of a quartz CVD jig is burned with an arc plasma torch 14 so that the OH concentration in the quartz surface remains under 30 ppm.

Jig for use in CVD and method of manufacturing jig for use in CVD

A semiconductor device has circuit patterns formed on upper and lower surfaces of a laminated board with both surfaces lined with copper and interconnected by through holes, an IC chip mounted on the upper pattern, and external connection terminals mounted on the lower pattern, the external connection terminals comprising copper core bumps. According to a method of manufacturing such a semiconductor device, the same etching process as pattern etching for forming the circuit pattern are effected in bump forming regions on the circuit pattern formed by the resist pattern.

Method of manufacturing semiconductor device with copper core bumps

A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Resin encapsulated semiconductor device

Resin encapsulated pin grid array and method of manufacturing the same

A method of making a resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Method of making a resin encapsulated pin grid array with integral

A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Growing community of inventors

Kawagoe, Japan

Seiichi Mimura