Sumitomo Wiring Systems, Limited

Seiichi Kurosawa

Shinsuke Tsutsui

Osamu Taniuchi

Hikaru Ito

Yasunori Wada

Naoya Hattori

Yumiko Muramoto

Toshiya Muraki

A fixed mold () has engaging pins () projecting towards a movable mold (). Each engaging pin () includes a shaft (A) and a large-diameter portion (C) formed at the leading end of the shaft (A). The large-diameter portions (C) of the engaging pins () interfere with the bottom surfaces of recesses () of an ejector plate () in the process of separating the movable mold (). Thus, the ejector plate () is moved forward relative to the movable mold () and leading ends of ejector pins () project from the movable mold ().

Mold for injection molding and a method of operating a mold

A moving mold 100 consisting of slidable housing molds 110 and 110 and retainer molds 120 and 120 and a fixed mold 200 pairing with the moving mold 100 are used to mold a housing 20 and retainers 30a and 30b in resin at the same time. When the fixed mold 200 and the moving mold 100 are opened, the housing molds 110 and 110 are opened and a space is formed between the housing 20 and the retainers 30a and 30b to be fitted to each other. The retainers 30a and 30b are pressed against the housing 20 with the retainers 30a and 30b held in the retainer molds 120 and 120 from both the left and right sides, whereby the housing 20 and the retainers 30a and 30b are assembled.

Manufacturing method of resin molded assembly

Manufacturing metal mold for assembling a resin molded assembly

Growing community of inventors

Yokkaichi, Japan

Seiichi Kurosawa