Canon Kabushiki Kaisha

Seiichi Kamiya

Masao Furukawa

Takashi Mori

Nobuhito Yamaguchi

Yuji Tsuruoka

Yoshiyuki Nakagawa

Ken Tsuchii

Masataka Sakurai

Akiko Saito

Hitoshi Iijima

Masaru Ohtsuka

Yusuke Imahashi

Akira Shibasaki

Kazuhiro Jindai

A liquid jet recording head includes a substrate including a plurality of discharge energy generating elements, and a plurality of ink supply ports positioned along an array direction of the plurality of discharge energy generating elements and separated from each other by beams, a plurality of ribs supported by the beams, and an orifice plate supported by the plurality of ribs, wherein the orifice plate includes discharge ports for discharging liquid droplets which enter from the plurality of ink supply ports and is provided with discharge energy by the plurality of discharge energy generating elements.

Inkjet recording head

The present invention provides liquid ejection head enables a reduction in the distance between a print medium and an ejection port formation face of the liquid ejection head on which an ejection port is formed, improving the landing accuracy of droplets ejected from the liquid ejection head. A print head according to the present invention includes an element substrate and a supporting member. A supporting portion is located in the space between the element substrate and the supporting member. Connection wiring is formed on the supporting portion. The connection wiring is provided which connects wiring inside of the supporting member provided in the supporting member to the heat generating element.

Liquid ejection head and method for manufacturing liquid ejection head

A circuit pattern forming method that can reduce a possibility of undesired short-circuits being produced in the circuit by satellites formed when fabricating a conductive pattern. Thereby, a highly reliable printed circuit board can be formed. A conductive pattern and an insulating pattern of a predetermined thickness are overlappingly drawn by scanning a liquid ejection head and a substrate relative to each other a plurality of times, while ejecting droplets of a conductive pattern forming solution and an insulating pattern forming solution. When forming the conductive pattern and the insulating pattern that adjoin each other on the substrate, the step of forming the insulating pattern of at least one scan is executed between the conductive pattern forming steps that are executed the plurality of times, until the conductive pattern has a predetermined thickness.

Circuit pattern forming method, circuit pattern forming device and printed circuit board

A plurality of conductive patterns are formed so as to be arranged in a scanning direction of a recording head. A state of each of the conductive patterns and a state between the adjacent conductive patterns are electrically checked to detect a wire break and a short circuit in the conductive patterns.

Pattern forming method and pattern forming apparatus

An object of the present invention is to provide a wiring module that enables dense mounting and a reduction in wiring distance. The wiring module in accordance with the present invention includes a base material, a plurality of electronic circuit parts, insulating portions, and conductive portions connected to the electronic circuit parts, the plurality of electronic circuit parts, the insulating portions, and the conductive portions being integrally held on the base material. Wires are composed of a stack of the conductive portions and extend in a direction crossing a surface of the base material and in a direction crossing a direction perpendicular to the base material surface to electrically connect the plurality of electronic circuit parts together.

Wiring module

A circuit pattern forming method includes a first ejection step of ejecting large droplets of a circuit pattern forming liquid onto a substrate, by causing a liquid ejection head to scan the substrate, to form first dots of the liquid on the substrate with gaps between the first dots, a second ejection step of ejecting, from the liquid ejection head, before the first dots formed on the substrate solidify, and while the liquid ejection head is caused to scan the substrate in the first ejection step, a small droplet, which is smaller in size than the large droplets, to form a second dot of the liquid between the first dots of the liquid on the substrate and, thereby to form a liquid circuit pattern by mixing the first dots and the second dot together, and a fixing step of solidifying the liquid circuit pattern to form a circuit pattern on the substrate.

Circuit pattern forming method and circuit pattern forming device

In the process of forming, on a substrate, a multi-layered circuit pattern with layers each having a portion made of the same material throughout the different layers in the direction in which the different layers are stacked, the position of nozzles with respect to the substrate when at least one of the layers is formed is shifted from that when the other layers are formed.

Method and apparatus for forming multi-layered circuit pattern

A circuit pattern forming device includes a liquid ejection device that ejects an insulating pattern forming solution and a conductive pattern forming solution onto a substrate to form insulating dots of the insulating solution and conductive dots of the conductive solution on the substrate. A control device controls an ejection operation that the liquid ejection device performs for each of the solutions. A moving device moves the liquid ejection device and the substrate relative to each other to form a circuit pattern composed of a plurality of the conductive dots and the insulating dots. The liquid ejection device includes a first nozzle array in which a plurality of nozzles for ejecting the insulating solution are arranged along a crossing direction crossing a main scan direction, and a second nozzle array in which a plurality of nozzles for ejecting the conductive solution are arranged along the crossing direction. The first nozzle array is disposed in front of the second nozzle array with respect to the main scan direction and the second nozzle array is arranged between a plurality of the first nozzle arrays. When the insulating dots and the conductive dots are formed close to each other on the substrate, the insulating dots, which are positioned in a direction in which the liquid ejection device moves relative to the substrate, are formed on the substrate prior to the conductive dots in a same main scan performed by the liquid ejection device.

Circuit pattern forming device and circuit pattern forming method

There is provided a shape measuring apparatus using an interferometer comprising a lens for condensing temporarily light waves from a light source, and a light wave shaping plate having a pinhole with suitable size adapted to convert the condensed light waves into an ideal spherical wave and a window provided in the vicinity of the pinhole and having enough size to pass therethrough light wave surface information, in which at least one lens having a reference surface and a surface to be measured the optical axes of which are slightly decentered in an optical path of the light waves passed through the pinhole is arranged in a position where the light waves which are made incident perpendicularly to the reference surface to be reflected therefrom pass through the pinhole again, and the light reflected from the surface to be measured pass through the window, and the reflected light reflected by the reference surface to pass through the pinhole again and the reflected light reflected by the surface to be measured to pass through the window are made to interfere with each other to measure a shape of the surface to be measured.

Growing community of inventors

Yokohama, Japan

Seiichi Kamiya