Hitachi Chemical Company, Ltd.

Seiichi Akagi

Shinsuke Hagiwara

Haruaki Sue

Fumio Furusawa

Akihiro Kobayashi

Hideki Yokoyama

Mitsuo Katayose

Kazuyoshi Tendo

Yoshinori Endou

Takatoshi Ikeuchi

Ryouichi Ikezawa

Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame retardance, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics and the like, and is suitably used for encapsulation of a VLSI. Also disclosed is an electronic component comprising an element encapsulated with such a material. (I) (In the general formula (I), Rs may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; n represents an integer of 0-4; Rs may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; and m represents an integer of 0-6.) 

Sealant epoxy-resin molding material, and electronic component device

This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorption, high adhesion and fluidity which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar and Ar are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.

Phenyl, naphthly or fluorene cyclopentyl epoxy resins

This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorptive, high adhesion and rich fluidity, which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar,and Ar,are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.

Phenyl, naphthyl or fluorene cyclopentyl epoxy resins

The present invention provides a resin containing in the backbone chain a structural unit represented by the following Formula (I) or (II), as a novel phenolic resin having a high Tg, a low moisture absorption, a low molding shrinkage, high adhesive properties and high flow properties. The present invention also provides a resin composition and a molding material each containing the above resin, and an electronic component device having a device element encapsulated with it.

Phenolic resin, resin composition, molding material for encapsulation, and electronic component device

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Chikusei, Japan

Seiichi Akagi