Hitachi, Ltd.

Seiichi Abe

Hirotsugu Yamagata

Kazunari Kano

Takahiro Sasakura

Tatsuhiko Fukazawa

Yuji Takei

Masanori Hori

Kenji Fujita

Toshiyuki Nakao

A memory data backup system capable of shortening time required to back up data from a volatile memory to a nonvolatile memory is provided. A nonvolatile memory moduleis mounted on the same busas a bus where an interface between a memory controllerA and a volatile memory moduleexists.

Memory data backup system and memory data backup control method

A storage system with excellent failure tolerance is provided. The storage system has redundant controllers. A first controller has a first memory for storing the data read/written from/to a storage device and control information concerning the reading/writing of data in the storage device. A second controller has a second memory for storing the data read/written from/to the storage device and control information concerning the reading/writing of data in the storage device. The first memory is structured so that it can be accessed from the second controller. The second memory is structured so that it can be accessed from the first controller.

Storage system with memories each having DIMMs daisy-chain connected to one another and control method thereof

There is provided a storage apparatus, which can continue processes to a host without making it recognize any soft errors as failure even if the errors occur in its microprocessor. The storage apparatus comprises: a plurality of host interface control circuits controlling data transfer with a host; a disk interface control circuit controlling data transfer with a physical memory device; a cache memory board storing the data temporarily; and a switch board connecting the host interface control circuits, disk interface control circuit, and cache memory board, wherein each of the host interface control circuits has two or more CPUs and when a soft error occurs in the CPU, data transfer process with the host is inherited to the CPU in which no soft error occurs, so that a reset process to the CPU in which the soft error has occurred is carried out.

Storage apparatus having microprocessor redundancy for recovery from soft errors

A deskew circuit includes, for clock and every bit of data, a variable delay circuit between a receiver that receives data and a flip-flop that first latches the data, in which a detecting pattern to detect a stable region for receiving data is repeatedly sent before implementing a data transfer, a delay value with which the starting edge an ending edge of the data match the rising edge of the clock is found for the variable delay circuit, and a delay value with which the transfer data can be received in a stable manner is set based on the delay value of the variable delay circuit.

Deskew circuit and disk array control device using the deskew circuit, and deskew method

A computing section controls a hot swap circuit, and DC/DC converters based on binary data from an ADC and an interrupt signal from respective comparing sections of a voltage detecting circuit. If the interrupt signal is input from any one of the respective comparing sections, the reading of binary data corresponding to the interrupt signal is halted. The binary data relating to the voltage detecting section corresponding to the interrupt signal, which is held in the SRAM at that time, is transferred to a non-volatile memory, where it is stored. When driving of the system has been halted, binary data is read out from the non-volatile memory, in order to analyze the cause of the error in a DC/DC converter which indicates an error output voltage from one of power supply circuits for supplying externally a plurality of different drive voltages to loads in a disk array unit.

Power supply control system and storage device for holding data just prior to the occurence of an error

A deskew circuit includes, for clock and every bit of data, a variable delay circuit between a receiver that receives data and a flip-flop that first latches the data, in which a detecting pattern to detect a stable region for receiving data is repeatedly sent before implementing a data transfer, a delay value with which the starting edge and ending edge of the data match the rising edge of the clock is found for the variable delay circuit, and a delay value with which the transfer data can be received in a stable manner is set based on the delay value of the variable delay circuit.

In the past, a power supply distance between a power source and an LSI package could not be shortened and power supply variations could easily produce an adverse effect. To reduce the power supply distance between the LSI and power supply module the power supply module is mounted on an upper surface of the LSI package. As a result, the power source noise can be reduced, the efficiency and response rate of the power source unit are high, and the generated electromagnetic field can be reduced. Moreover, since each LSI package has a power supply module required therefore, the number of required power source types (voltage types) on the substrate with the package mounted thereon can be decreased. As a result, the mounting efficiency can be increased and the substrate can be manufactured at a low cost.

Semiconductor integrated circuit modules, manufacturing methods and usage thereof

A memory package for storing data and capable of being added to or replaced while being provided with a battery backup in computer systems which can be mounted with a plurality of said memory packages. A memory package also has a function to reduce power consumption of the battery backup to a minimum, when the memory package with battery backup is inserted into the computer system without the main power being applied. Consequently, even if additional memory packages are inserted which require battery backups, only a weak current need be supplied from the backup power supply so that the battery will not run down after a short time. The memory packages can therefore be added and replaced while still storing data internally and the memory capacity can be changed. Also, a memory system is provided including a power supply supplying power supply lines connected to the memory packages. Diode and/or surge protection arrangements are also provided to facilitate hot line insertion and removal.

Memory package, memory system and hot-line insertion/removal method thereof

A memory package for storing data and capable of being added to or replaced while being provided with a battery backup in computer systems which can be mounted with a plurality of said memory packages. A memory package also has a function to reduce power consumption of the battery backup to a minimum, when the memory package with battery backup is inserted into the computer system without the main power being applied. Consequently, even if additional memory packages are inserted in computer systems installable with memory packages having battery backups, only a weak current need be supplied from the backup power supply so that the battery will not run down after a short time. The memory packages can therefore be added and replaced while still storing data internally and the memory capacity can be changed. Also, a memory system is provided including a power supply supplying power supply lines connected to the memory packages. Diode and/or surge protection arrangements are also provided to facilitate hot line insertion and removal.

Memory package and hot-line insertion/removal method using time constant

A magnetic disk sub-system provides for sudden cutting off of a main power supply such as a power failure so that the backup by battery is effected to supply electric power to the cache memory from a battery upon cutting off of the main power supply in order to protect data in the cache memory and when the main power supply is cut off by operation of a main power supply switch the backup by battery is stopped to cut off supply of electric power to the cache memory from the battery after data in the cache memory is written into a magnetic disk unit and supply of electric power from the main power supply is then cut off. Further, the magnetic disk sub-system divides the cache memory into several portions so that the backup by battery can be controlled independently to thereby extend the backup period.

Magnetic disk controller for backing up cache memory

For a DRAM provided with a self-refreshing function, self-refresh starting operations and execution of the self-refresh mode are performed when the power supply voltage is cut off thereby achieving battery backup of the DRAM. This is achieved by detecting when the power supply voltage is at the lowest voltage at which normal data transfer can be performed. The operations carried out by the DRAM control circuit relate to stopping transfer of the following data after completing any transfer that was in the course of execution, executing refreshing, and establishing the self-refresh mode. All except for the last function are preceding processes for self-refreshing. Then, when the voltage of the power supply is determined to be in the proximity of the lowest voltage at which the DRAM drive circuit can perform normally, the drive circuit is disabled and the RAS and CAS signals of the drive circuit go low by means of pull-down resistors so that the self-refresh mode is established.

Circuit and method for retaining DRAM content

A soldering method of this invention has the steps of coating a plurality of lead terminals of an electronic component with connecting paste-like solders corresponding to lead terminals on conductive pads disposed on a substrate, holding the electronic component at the position separated from the corresponding paste-like solders at the lead terminals, and thereafter moving the substrate into a heating atmosphere furnace to melt the paste-like solder. In the melting step, the paste-like solders start melting when the temperatures of the pads arrive at the melting point of the solder and flow on the pads until contacting with the corresponding lead terminals. Thus, improper connection of the lead terminals to the pads due to smaller thermal capacity of the lead terminals than that of the substrate including the pads can be eliminated and productivity can be greatly improved.

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Odawara, Japan

Seiichi Abe