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Seihachi Arai

Toshiyuki Arai

The invention mainly relates to a heat radiator for performing heat radiation of electronic parts (heat generating elements) that are heated by electric supply, such as semiconductor parts to be mounted on a circuit board surface of a printed circuit board. The heat radiator (1) according to the present invention is a heat radiator in which vertical heat radiative portions are formed by bending both right and left ends of a back surface plate (2) to the front face side. The heat generating element (5) that is an electronic part is mounted on the surface on the front face side or the back face side of the back surface plate. The radiating portions are further bent inwardly to form sleeve portions (3) extending up and down. Slits (12a) are formed on outer peripheral walls of the sleeve portions (3) for ventilating air. Inside the right and left sleeve portions (3), the bent back end sides of the peripheral walls of the sleeve portions (3) form bent back portions (4) bent and formed along the back surface plate. Furthermore, plate-like pressure portions (26) are provided in the inner end side of the bent back portions (4). The heat generating element (5) is inserted in between the back faces of the pressure portions (26) and the front surface of the back surface plate (2) and held in place by the pressure plate (26) and the back surface plate (2) to thereby define a part mountable space made of a space for securely holding the heat generating element (5).

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Saitama-ken, Japan

Seihachi Arai