Hitachi Cable, Inc.

Hitachi Metals, Ltd.

Hitachi Cable Fine-tech, Ltd.

Seigi Aoyama

Toru Sumi

Hiromitsu Kuroda

Takaaki Ichikawa

Hideyuki Sagawa

Koichi Tamura

Hakaru Matsui

Takahiro Sato

Hiroshi Okikawa

Ryohei Okada

Osamu Seya

Hiroshi Yamanobe

Masayoshi Goto

Masato Ito

Hiroyoshi Hiruta

Detian Huang

Keisuke Fujito

Hiroshi Bando

Toshiyuki Horikoshi

Hiroshi Komuro

Katsuo Endo

Hideo Kawano

Hidenori Abe

Tsutomu Komori

Kiyoshi Shimojima

Takamitsu Kimura

Masato Watabe

Nobuyuki Yamashita

Mamoru Mita

Takashi Nemoto

Takashi Hayasaka

Masahiko Kobayashi

Takayuki Tsuji

Yuju Endo

Yuzo Ito

Hajime Nishi

Tamotsu Sakurai

Seiji Mizuniwa

Michiaki Shimizu

Shinsuke Murano

Fumitaka Nakahigashi

Kazuma Kuroki

Takeshi Usami

Shoji Takagi

Iku Higashidani

Akio Hattori

Shuji Sakai

Minoru Takatsuto

Tooru Kurihara

Noboru Nakakuki

Satoshi Yajima

Yoshiharu Masaki

Atsushi Ohtake

Shigetoshi Goto

Hidenori Kobayashi

Konichi Nakamura

Takahiko Hanada

A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.

Method for manufacturing a conductive wire

A soft dilute copper alloy material includes 2 mass ppm to 12 mass ppm of sulfur, more than 2 mass ppm and not more than 30 mass ppm of oxygen, 4 mass ppm to 55 mass ppm of Ti, and a balance including copper. An average crystal grain size is not more than 20 &#x3bc;m in a surface layer up to a depth of 50 &#x3bc;m from a surface. The average crystal grain size in the surface layer is less than the average crystal grain size in an inner portion located more interiorly than the surface layer.

Soft-dilute-copper-alloy material, soft-dilute-copper-alloy wire, soft-dilute-copper-alloy sheet, soft-dilute-copper-alloy stranded wire, and cable, coaxial cable and composite cable using same

A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.

Copper-based material and method for producing the same

A dilute copper alloy material includes, based on a total mass of the dilute copper alloy material, 2 to 12 mass ppm of sulfur, 2 to 30 mass ppm of oxygen, 4 to 55 mass ppm of titanium, and a balance of pure copper and inevitable impurity. A part of the sulfur and the titanium forms a compound or an aggregate of TiO, TiO, TiS or Ti&#x2014;O&#x2014;S, and an other part of the sulfur and the titanium forms a solid solution. TiO, TiO, TiS and Ti&#x2014;O&#x2014;S distributed in a crystal grain of the dilute copper alloy material are not more than 200 nm, not more than 1000 nm, not more than 200 nm and not more than 300 nm, respectively, in particle size thereof, and not less than 90% of particles distributed in a crystal grain of the dilute copper alloy material are 500 nm or less in particle size.

Dilute copper alloy material, dilute copper alloy wire, dilute copper alloy twisted wire and cable using the same, coaxial cable and composite cable, and method of manufacturing dilute copper alloy material and dilute copper alloy wire

A dilute copper alloy material used in an environment with presence of hydrogen includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Ca, V, Fe, Al, Si, Ni, Mn, Ti and Cr, the additive element being capable of forming an oxide in combination with the oxygen. A method of manufacturing a dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement includes melting the dilute copper alloy material by SCR continuous casting and rolling at a copper melting temperature of not less than 1100&#xb0; C. and not more than 1320&#xb0; C. to make molten metal, forming a cast bar from the molten metal, and forming the dilute copper alloy member by hot-rolling the cast bar.

Dilute copper alloy material and method of manufacturing dilute copper alloy member excellent in characteristics of resistance to hydrogen embrittlement

Provided are a soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire which have high electrical conductivity and high bending life and can limit disconnection during use compared with oxygen-free copper wire, and also provided are an insulated wire, coaxial cable, and composite cable using the soft dilute-copper alloy wire and soft dilute-copper alloy twisted wire. The soft dilute-copper alloy wire is subjected to annealing treatment by elongation processing of soft dilute-copper alloy material comprising copper and an additive element selected from the group consisting of Ti, Mg, Zr, Nb, Ca, V, Ni, Hf, Fe, Mn and Cr, with inevitable impurities as the balance, wherein the soft dilute-copper alloy wire has an average grain size that is 20 &#x3bc;m or less in a surface layer having a depth of 50 &#x3bc;m from the surface, and an elongation value that is at least 1% higher than the average elongation value of oxygen-free copper wire that has been subjected to the aforementioned annealing treatment.

Soft dilute-copper alloy wire, soft dilute-copper alloy twisted wire, and insulated wire, coaxial cable, and composite cable using these

A high-speed transmission cable conductor includes a core material includes mainly copper, and a surface treated layer formed around a surface of the core material. The surface treated layer includes an amorphous layer including a metal element having a higher affinity for oxygen than the copper, and oxygen.

High-speed transmission cable conductor, and producing method thereof, and high-speed transmission cable

An audio/video cable includes an insulated layer including a copper conductor for transmitting audio/video signals and an insulation layer formed on a periphery thereof. The copper conductor includes a soft dilute copper alloy material containing pure copper, Ti as an additive element and an inevitable impurity as a balance. The soft dilute copper alloy material includes a recrystallized structure having a grain size distribution such that crystal grains in a surface layer are smaller than internal crystal grains. The soft dilute copper alloy material includes not less than 2 and not more than 12 mass ppm of sulfur, more than 2 mass ppm but not more than 30 mass ppm of oxygen, and not less than 4 and not more than 55 mass ppm of Ti.

Audio/Video cable

A copper alloy conductor has a copper alloy material which has a copper parent material with 0.001 to 0.1 wt % (=10 to 1000 wt&#xb7;ppm) of oxygen and 0.15 to 0.70 wt % (exclusive of 0.15 wt %) of Sn. A crystalline grain to form a crystalline structure of the copper alloy material has an average diameter of 100 &#x3bc;m or less, and 80% or more of an oxide of the Sn is dispersed in a matrix of the crystalline structure as a fine oxide grain with an average diameter of 1 &#x3bc;m or less.

Copper alloy conductor, and trolley wire and cable using same, and copper alloy conductor fabrication method

A weldment includes metal materials that are welded to each other. At least one of the metal materials includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Fe, Si, Al, Ca, V, Ni, Mn, Ti and Cr. A method of manufacturing a weldment includes melting a dilute copper alloy material by SCR continuous casting and rolling at a molten copper temperature of not less than 1100&#xb0; C. and not more than 1320&#xb0; C. to make a molten metal, forming a cast bar from the molten metal, forming a dilute copper alloy member by hot-rolling the cast bar, and welding the dilute copper alloy member to a metal material. The dilute copper alloy material includes the pure copper, more than 2 mass ppm of oxygen, and the additive element,?

Weldment

A method of manufacturing a Cu alloy conductor includes the steps of:

Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor

An audio/video cable includes a plurality of parallel arranged insulated wires or twisted pair insulated wires each including a copper conductor and an insulation layer formed on a periphery thereof. The copper conductor includes a soft dilute copper alloy material containing pure copper, an additive element and an inevitable impurity as a balance. The soft dilute copper alloy material includes a recrystallized structure having a grain size distribution such that crystal grains in a surface layer are smaller than internal crystal grains. The surface layer includes a crystal structure such that an average crystal grain size from a surface of the surface layer up to a depth of 50 &#x3bc;m toward inside of the soft dilute copper alloy material is not more than 20 &#x3bc;m.

Audio/video cable

The present invention provides a flexible flat cable having high conductivity and high bending durability, and a method for manufacturing the same. The present invention is a flexible flat cable comprising conductors and insulating films applied over the conductors, wherein the conductor is comprised of at least one additive element selected from the group consisting of magnesium (Mg), zirconium (Zr), niobium (Nb), calcium (Ca), vanadium (V), nickel (Ni), manganese (Mn), titanium (Ti), and chromium (Cr); 2 mass-ppm or more of oxygen; and the balance being inevitable impurity and copper, wherein the conductor has such a recrystallized texture that the size of crystal grains in the inner area of the conductor is large and that of in the surface area thereof is smaller than that of the inner area, wherein both sides of the conductor are sandwiched between insulating films.

Flexible flat cable with dilute copper alloy containing titanium and sulfur

A method of making a copper wire rod with low semi-softening temperature includes melting a raw material copper to have a copper melt, adjusting concentrations of oxygen and sulfur included in the copper melt to be not more than 20 ppm and not more than 6 ppm, respectively, continuously casting the adjusted copper melt at temperature not higher than 1120&#xb0; C. to have a cast bar, and hot-rolling the cast bar in a temperature range of 850&#xb0; C. to 550&#xb0; C.

Method of making copper wire rod with low semi-softening temperature, method of making copper wire and copper wire

A solar cell lead wire includes a conductive material, and a solder plated layer on a periphery of the conductive material. The solder plated layer is formed flat by rolling. A method of manufacturing a solar cell lead wire includes feeding an elongate conductive material from a feed reel, the elongate conductive material including a rectangular conductor or a round conductor, soaking the conductive material in a molten solder in a molten solder plating bath, cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material, and winding the plated wire on a winding reel. The plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling.

Method of manufacturing a solar cell lead wire

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Kitaibaraki, Japan

Seigi Aoyama