Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Nuvoton Technology Corporation Japan

Matsushita Electric Industrial Co., Ltd.

Panasonic Semiconductor Solutions Co., Ltd.

Sei Suzuki

Junichi Matsuo

Tohru Yamada

Yasuyuki Shimizu

Takuya Asano

Hiroshi Matsumoto

Takumi Yamaguchi

Yoshiaki Kato

Hiroyoshi Komobuchi

Takao Kuroda

Mamoru Iesaka

Koichi Yonemura

Yasuhiro Morinaka

Takuya Nohara

Nobuhiko Mutoh

Akito Kidera

Katsuya Furukawa

Shinichi Kawai

A solid-state imaging device includes a plurality of pixels arranged in matrix form, each pixel including a photoelectric converter and a plurality of first transfer electrodes, and a plurality of control lines connected to mutually-corresponding ones of the first transfer electrodes in a plurality of pixels arranged in a specific row. The plurality of pixels include a plurality of first pixels and second pixels. Each of the first pixels includes a floating diffusion layer and a readout circuit. Each of the second pixels shares the floating diffusion layer with one of the first pixels arranged in a column direction. At least some of the plurality of control lines are further connected to the first transfer electrodes of pixels that are arranged adjacent in the column direction to respective ones of the plurality of pixels arranged in the specific row and that share at least one of the floating diffusion layers.

Solid-state imaging device and imaging device provided with same

A solid-state imaging device includes: a plurality of pixels arranged in a matrix on a semiconductor substrate, wherein each of the plurality of pixels includes: a photoelectric converter that converts received light into a signal charge; a plurality of read gates that each read the signal charge from the photoelectric converter; a plurality of charge accumulators that each accumulate the signal charge read by any one of the plurality of read gates; and a charge holder that receives, from one of the plurality of charge accumulators, transfer of the signal charge accumulated in the charge accumulator, holds the signal charge, and transfers, to one of the plurality of charge accumulators, the signal charge held.

Solid-state imaging device and imaging apparatus including same

A solid-state imaging device includes: pixels arranged in a matrix on a semiconductor substrate. Each of the pixels includes: a photoelectric converter that converts received light into a signal charge; at least one read gate that reads the signal charge from the photoelectric converter; charge accumulators that each accumulate the signal charge read by the at least one read gate; and a charge holder that receives, from one of the charge accumulators, transfer of the signal charge accumulated in the charge accumulator, holds the signal charge, and transfers, to one of the charge accumulators, the signal charge held, each of the charge accumulators includes a part of a transfer channel and a part of a transfer electrode overlapping with the part of the transfer channel in a planar view of the semiconductor substrate, and the transfer channel per one pixel comprises transfer channels.

A solid-state imaging device includes pixels arranged in matrix form, each including a photoelectric converter and first transfer electrodes, and control lines connected to mutually-corresponding ones of the first transfer electrodes in pixels arranged in a specific row. The pixels include first pixels that receive visible light and second pixels that receive infrared light. Each of floating diffusion layer-including pixels, which are some of the plurality of pixels, further includes a floating diffusion layer and a readout circuit. Each floating diffusion layer-lacking pixel shares the floating diffusion layer with one of the first pixels arranged in a column direction. At least some of the control lines are further connected to the first transfer electrodes of pixels arranged adjacent in the column direction to respective ones of the pixels arranged in the specific row and that share at least one of the floating diffusion layers.

Solid-state imaging device and imaging device including the same

Provided is a method for driving a solid-state imaging device including a unit pixel which includes at least a first pixel including: a photoelectric converter which receives reflected light from an object and converts the reflected light into charge; an exposure resetter which switches between exposure and discharge of the charge in the photoelectric converter; and a plurality of readers which read the charge from the photoelectric converter and include at least a first reader and a second reader. The method includes: performing a first exposure as the exposure that is performed in a first period in which a gate of the first reader is ON; and performing a second exposure as the exposure that is performed in a second period which is started in conjunction with the end of the first period and in which a gate of the second reader is ON.

Method for driving solid-state imaging device

A plurality of pixels of a solid-state imaging device include: a photoelectric converter which receives light from an object and converts the light into charge; a plurality of readers which read the charge from the photoelectric converter; a plurality of charge accumulators which accumulate the charge of the photoelectric converter; and a transfer controller which performs a transfer control including controlling whether the charge is transferred or blocked from being transferred. The readers read the charge of the photoelectric converter to the charge accumulators, the plurality of pixels include at least a first pixel and a second pixel, and the transfer controller performs the transfer control to cause addition of the charge read from each of the first pixel and the second pixel.

Solid-state imaging device having increased distance measurement accuracy and increased distance measurement range

An image-capturing device includes an infrared light source configured to emit infrared light, and a solid-state image-capturing device including a plurality of first pixels configured to convert visible light into signal charge and a plurality of second pixels configured to convert infrared light into signal charge, the plurality of first pixels and the plurality of second pixels being arranged on a semiconductor substrate in a matrix. The solid-state image-capturing device outputs, during the same single frame scanning period, a first signal obtained from the plurality of first pixels, a second signal obtained from the plurality of second pixels during a period of time when the infrared light is emitted, and a third signal obtained from the plurality of second pixels during a period of time when the infrared light is not emitted.

Image-capturing device and drive method therefor

A plurality of pixels of a solid-state imaging device include: a photoelectric converter which receives light from an object and converts the light into charge; a plurality of readers which read the charge from the photoelectric converter; a plurality of charge accumulators each of which accumulates the charge of the photoelectric converter read from the plurality of readers; and a transfer controller which performs a transfer control including controlling whether the charge accumulated in one of the plurality of charge accumulators is transferred or blocked from being transferred to another one of the plurality of charge accumulators. The transfer controller is disposed between the plurality of charge accumulators.

Solid-state imaging device

Provided is an a imaging device that acquires a distance image excluding influence of background light in one frame scanning period and acquires a visible image in a separate frame from a single imaging sensor, and includes an infrared light source that emits infrared light, and a solid state imaging device including a plurality of first pixels and a plurality of second pixels, which respectively include vertical overflow drains, and are arranged in a matrix on a semiconductor substrate, the plurality of first pixels converting the infrared light into signal charges, and the plurality of second pixels converting visible light into signal charges. The solid state imaging device outputs a first signal obtained from the plurality of first pixels in an irradiation period of infrared light, and a second signal obtained from the plurality of first pixels in a non-irradiation period of infrared light, in a first frame scanning period, and outputs a third signal obtained from the plurality of first pixels and a fourth signal obtained from the plurality of second pixels, in a second frame scanning period.

Solid state imaging device and imaging device and driving method thereof

A solid-state imaging device of the present invention is capable of thinning signals for each column. The solid-state imaging device includes: photo diodes, a drain into which charges transferred by first column CCDs are swept-off, and transfer control units each of which is provided to the corresponding first column CCDs, and transfers, to a row CCD and to the drain, the charges transferred by the corresponding first column CCDs. Each of the transfer control units includes: a second column CCD which transfers, in a column direction, the charges transferred by the first column CCDs corresponding to the transfer control unit, and a column CCD terminal gate which is provided between the second column CCD and the row CCD, and forms a potential barrier between the second column CCD and the row CCD.

Solid-state imaging device and driving method of solid-state imaging device

A solid-state imaging device includes photoelectric conversion units, vertical transfer units including vertical transfer electrodes, a horizontal transfer unit, a distribution transfer unit including distribution transfer electrodes, and first light-shield layers and second light-shield layers provided on the vertical transfer units and the distribution transfer unit. The first light-shield layers and the second light-shield layers are conductive. The first light-shield layers are provided in a layer different from a layer in which the second light-shield layers are provided. At least one of the first light-shield layers serves as an interconnect electrically connected to the vertical transfer electrodes included in the same row, and at least one of the first light-shield layers on the distribution transfer unit serves as an interconnect electrically connected the distribution transfer electrodes. The first light-shield layers are disposed so as not to overlap with the horizontal transfer unit.

Solid state imaging device

A solid-state image sensor includes: a transfer control section configured to control charge transfer from the vertical transfer section to the horizontal transfer section. The transfer control section has a plurality of unit control sections corresponding to the transfer packets. The unit control section has a vertical transfer channel and a plurality of control section electrodes formed over the vertical transfer channel. The control section electrodes include a signal charge accumulating electrode and a transfer inhibiting electrode, which are sequentially formed from a side of the vertical transfer section. The vertical transfer channels are independently connected to a horizontal transfer channel. When stopping the charge transfer from the vertical transfer section to the horizontal transfer section, a high-level voltage is applied to the signal charge accumulating electrode, and a low-level voltage is applied to the transfer inhibiting electrode.

Solid-state image sensor and camera

A solid-state imaging device includes a source-follower amplifier having a driver transistor and a load circuit connected to the driver transistor. The load circuit is structured by a first MOS transistor having a gate with a fixed potential, and a load device connected to a source of the first MOS transistor. Furthermore, the load circuit of the source-follower amplifier is structured by a plurality of serially connected MOS transistors. Furthermore, by adapting a structure using a current mirror circuit, load conductance is reduced.

Solid-state image sensing device and camera

In making solid state imaging devices smaller and increasing their number of pixels, it is desirable to increase the charge amount that can be handled per unit area of the transfer portions. It is possible to achieve this by making the insulating film thinner, but this leads to electric fields in the semiconductor substrate that are too strong, and causes problems such as the generation of noise and the deterioration of the transfer efficiency. This invention relaxes potential steps in the transfer region by applying, when a signal chargeis being read out (t=t), a high voltage to the electrodefor reading out the signal charge, a low voltage to at least one of the electrodesfor preventing unnecessary mixing of signal charges, and an intermediate voltage between the high voltage and the low voltage to the electrodesand, which are adjacent to the electrodeto which the high voltage is applied.

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Osaka, Japan

Sei Suzuki