Renesas Electronics Corporation

Sei Saitou

Satoru Akiyama

Hiroyoshi Kobayashi

Hisao Inomata

A semiconductor device, including a first semiconductor chip including a first substrate having a semiconductor larger in bandgap than silicon, the first semiconductor chip being formed with a first FET including a first gate electrode, a first source, and a first drain, a second semiconductor chip including a second substrate having a semiconductor larger in bandgap than silicon, the second semiconductor chip being formed with a second FET having a second gate electrode, a second source, and a second drain, and a third semiconductor chip including a third substrate having silicon, the third semiconductor chip being formed with a MOSFET including a third gate electrode, a third source, and a third drain. The first semiconductor chip and the second semiconductor chip are mounted over a first chip mounting section, and the third semiconductor chip is mounted over a second chip mounting section.

Semiconductor device and electronic apparatus

The manufacturing yield of a semiconductor device is improved. There is provided a semiconductor device of a cascode coupling system, which is equipped with a plurality of normally-on junction FETs using as a material, a substance larger in bandgap than silicon, and a normally-off MOSFET using silicon as a material. At this time, the semiconductor chip has a plurality of junction FET semiconductor chips (semiconductor chip CHPand semiconductor chip CHP) formed with the junction FETs in a divided fashion, and a MOSFET semiconductor chip (semiconductor chip CHP) formed with the MOSFET.

Growing community of inventors

Kawasaki, Japan

Sei Saitou