Samsung Electronics Co., Ltd.

Sei-jin Kim

Han-gu Sohn

Tae-young Kim

Kwang-il Park

Young-Soo Sohn

Chul-woo Park

Hoon Moo Choi

Yoon-Ho Khang

Yun-Tae Lee

Doo-Gon Kim

Taketo Maesako

Woo-seop Jeong

Hui-Kwon Seo

Hui-kwon Seo

Woon-Sik Suh

Hai-jeong Sohn

Cheol-kyu Kim

Hyungbok Kim

Hyung-bok Kim

Tae-yon Lee

Dae-won Ha

A memory device performing an internal copy operation is provided. The memory device may receive a source address, a destination address, and page size information together with an internal copy command, compares the source address with the destination address, and performs an internal copy operation. The internal copy operation may be an internal block copy operation, an inter-bank copy operation, or an internal bank copy operation. The internal copy operation may be performed with respect to one-page data, half-page data, or quarter-page data, based on the page size information. The memory device may output as a flag signal a copy-done signal indicating that the internal copy operation has been completed.

Memory device that performs internal copy operation

A memory device, system, and/or method are provided for performing a page state informing function. The memory device may compare one or more row addresses received along with a command, determine the page open/close state according to a page hit or miss generated as a result of comparison, count read or write commands with respect to pages corresponding to a same row address, and determine the page open/close state according to a read or write command number generated as a result of counting. The memory device may determine a page open/close state with respect to a corresponding page based on a page hit/miss and a read or write command number and output a flag signal. The memory device may provide the page open/close state for each channel. A memory controller may establish different page open/close policies for each channel.

Memory device having page state informing function

A memory system includes a memory cell array having a plurality of memory sectors. Each memory sector includes a plurality of memory cells. The memory system further includes a controller configured to write data to the memory cell array in response to a writing signal. The controller is further configured to refresh a memory sector among the plurality of memory sectors each time a writing signal is provided. When N (N is a positive integer) memory cells are programmed, a programming current is less than or equal to about 0.75 mA*N.

Memory controllers to refresh memory sectors in response to writing signals and memory systems including the same

A system having a memory device accessible by a plurality of processors is provided. The system includes a memory device, a first processor, and a second processor. The memory device has a first memory array part and a second memory array part. The first processor predominantly accesses the first memory array part of the memory device and selectively accesses the second memory array part of the memory device. The second processor predominantly accesses the second memory array part of the memory device and selectively accesses the first memory array part of the memory device.

System having memory device accessible to multiple processors

Example embodiments relate to a semiconductor memory system which may include a volatile memory and a non-volatile memory that share a common bus, and a method for controlling the operation of the non-volatile memory. The semiconductor memory system may include a non-volatile memory and a memory controller. The non-volatile memory may include a buffer memory that temporarily stores data to be read from or to be written to a memory cell array, and an internal controller. The memory controller may transmits a mode signal to the non-volatile memory in response to a control signal, the control signal corresponds to either a read mode or a write mode to be applied to the non-volatile memory. In response to the mode signal, the internal controller may control the data to be read to be stored in the buffer memory, if the read mode is to be applied, and the internal controller may control the buffer memory to stand-by until a write command is received, if the write mode is to be applied.

Semiconductor memory system having volatile memory and non-volatile memory that share bus, and method of controlling operation of non-volatile memory

A memory system includes a first external device, a second external device, and a multi-port memory device connected to the first and second external devices. The multi-port memory system includes: a first port and a second port connected to the first and second external devices, respectively, a first bank group having at least one memory bank, the first bank group configured to be accessed by the first external device through the first data port; a second bank group having at least one memory bank, the second bank group configured to be accessed by the second external device through the second data port; a third bank group having at least one memory bank, wherein the third bank group is configured to be selectively accessed by the first external device through the first data port or the second external device through the second data port. The multi-port memory system may prevent data collisions which occur when two ports simultaneously attempt to access the same memory bank.

Multi-port memory device providing protection signal

Circuits and methods for controlling data I/O operations in semiconductor memory devices to provide variable data I/O widths for read, write and active memory operations. Circuits and methods for selectively controlling a data width of a data I/O buffer 'on the fly' to enable variable data I/O widths during memory access operations.

Circuits and methods for providing variable data I/O width for semiconductor memory devices

A semiconductor device is provided. The semiconductor device includes a storage part storing an address for weak cells in a nonvolatile state; and a dynamic semiconductor memory device including: a memory cell array having normal cells and the weak cells to be refreshed; and a refresh control part performing a refresh operation for the weak cells, wherein a refresh period for the weak cells is shorter than a refresh period for the normal cells when the address applied in a refresh operation mode coincides with the address stored in the storage part.

Non volatile semiconductor memory device having a multi-bit cell array

A semiconductor device includes a memory cell array, including at least one of a plurality of memory cells storing program data received from a flash memory, a row address buffer, which receives a row address signal in response to a first strobe signal, and a column address buffer, which receives a column address signal in response to a second strobe signal. The device further includes a write protection circuit, enabled/disabled in response to a first control signal, the write protection circuit outputting a masking control signal in response to the row address signal, the second strobe signal, and second control signals when enabled, and a column decoder, which decodes the column address signal in response to the masking control signal and enables at least one of a plurality of column selection lines of the memory cell array, corresponding to the decoded column address signal, or disables the column selection lines.

Semiconductor memory device and method for masking predetermined area of memory cell array during write operation

A semiconductor memory device for improving the transmission data rate of a data input and output bus, and a memory module including the same, are provided. The memory module includes a plurality of clock synchronous memory devices that share a single data bus line. More specifically, the memory module includes a printed circuit board having an electrical connector including the data bus line, a first set of synchronous memory devices arrayed on the printed circuit board, a second set of synchronous memory devices arrayed on the print circuit board, and a clock signal generator electrically connected to the first and second set of synchronous memory devices. The clock signal generator operates to receive a clock signal from the electrical connector and to generate a first clock signal that is matched with the received clock signal and a second clock signal that is delayed with respect to the received clock signal for half the period of the received clock signal. In the memory module, memory data in the first set and memory data in the second set are alternately output to the data bus line.

Semiconductor memory device and method for improving the transmission data rate of a data input and output bus and memory module

In a semiconductor memory device, and in particular in a NAND-type ROM memory cell, the transistors of a memory cell region and a peripheral circuit portion are manufactured to include a first and second impurity regions. The second impurity region has a higher impurity density impurity than the first impurity region. A third impurity region is added which has a higher impurity density and shallower depth than the impurity density of the first impurity region. Accordingly, the conventional transistor structure of the peripheral circuit portion is maintained while the transistors of the memory cell are optimized to have ideal electrical characteristics, including an increased current driving capability.

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Seongnam-si, South Korea

Sei-jin Kim