Ehwa Diamond Industrial Co., Ltd.

Samsung Electronics Co., Ltd.

Seh-kwang Lee

Sang-Wook Park

Hyo-San Lee

Joo-han Lee

Rak-Joo Sung

Kyu-min Oh

Yung-jun Kim

Sun-gyu Park

Myung-ki Hong

Sung-oh Park

Chan-ki Yang

A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.

Preparing conditioning disk for chemical mechanical polishing and chemical mechanical polishing method including the same

The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the invention, the method for manufacturing an electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region.

Method for manufacturing an electrodeposited diamond wire saw using patterned non-conductive materials

Growing community of inventors

Yongin-si, South Korea

Seh-kwang Lee