Asm Technology Singapore Pte Ltd

See Yap Ong

Shu Chuen Ho

Teng Hock Kuah

Ji Yuan Hao

Ee Ling Chiw

Si Liang Lu

Teng Hock Eric Kuah

Kai Wu

Ka Shing Kwan

Jian Wu

Jie Liu

Xiang Chen

Jian Xiong Su

Zheng Yu Gao

Tong Heng Cheah

Keng Hock Chew

Kock Hien Wee

Swee Huat Lee

Kun Quan Fan

A substrate having a plurality of protrusion members on its surface is molded by a molding system comprising first and second molds cooperating to apply a clamping force onto the substrate for molding, and a middle plate located between the first and second molds such that the substrate is clamped between the middle plate and the first mold during molding. A plurality of molding cavities is located on the second mold and through-holes formed in the middle plate correspond to positions of the molding cavities, such that each through-hole is sized and configured for inserting a protrusion member of the substrate to enable each protrusion member to be in communication with a molding cavity of the second mold. Molding compound is molded onto the protrusion members by the molding cavities during molding.

Optical device molding system

An SMT screen printeris disclosed herein. In a described embodiment, the screen printercomprises: i) a stencilwith a plurality of apertures; ii) a paste dispenser arranged to dispense a paste material through the plurality of apertures of the stencil to form a print pattern of the stencil to form a print pattern of the paste material on an electronic device; iii) an image capturing device in the form of a fiducial cameraarranged to capture at least one image of the plurality of aperturesof the stencil; iv) a processorarranged to select which of the aperturesrequire cleaning based on the at least one captured image; and v) a cleaning devicearranged to clean the selected apertures. A method of cleaning a stencilof an SMT screen printeris also disclosed.

Screen printer, and method of cleaning a stencil of a screen printer

A method of molding a substrate containing a plurality of electronic devices by providing a carrier comprising a frame which includes an adhesive film. The substrate is mounted onto the adhesive film of the carrier such that the frame surrounds the substrate. The carrier is placed in a mold such that the frame is located at a clamping area of the mold and the substrate is located at a molding area of the mold where molding cavities are located. The frame is clamped at the clamping area while the electronic devices are located in the molding cavities for molding with an encapsulant.

Substrate carrier for molding electronic devices

A compression molding system comprising first and second mold halves is provided for an electronic device wherein a plurality of cavities are formed in the first mold half corresponding to molding locations on the electronic device. A plurality of plungers are located in the first mold half, each of which is drivable against a side of a respective cavity for applying a compacting force to encapsulation material located in the cavity during molding. A motor is operatively connected to the plungers for driving the plungers relative to the cavities.

Compression molding of an electronic device

An apparatus and process are provided for molding electronic devices in a mold, which apparatus comprises at least one runner in the mold connected to a mold supply pot for channeling a molding compound from the mold supply pot to the electronic devices. A plunger assembly is also provided that comprises a main body, and a supplementary body configured to be movable relative to the main body. The plunger assembly is locatable in the mold supply pot and is drivable in a direction towards the runner for forcing the molding compound into the runner. In order to avoid or reduce cull formation, a width of the runner at an opening connecting the runner to the mold supply pot is smaller than a width of the main body of the plunger assembly.

Method and apparatus for molding with reduced cull formation

An apparatus and method for degating is provided for separating excess molding material from encapsulated electronic packages while the electronic packages are located in a molding system. At least one holding device is coupled to a mold of the molding system, which is located such that excess molding material is molded onto at least a portion of the holding device during molding. A locking feature on the portion of the holding device locks the excess molding material such that the holding device may hold the excess molding material molded onto it to forcibly separate the excess molding material from the encapsulated electronic packages after molding.

Apparatus and method for in-mold degating

The invention provides a molding system for encapsulating a piece of substrate having a plurality of molding sections. The system comprises a molding device operative to separately encapsulate each molding section with a molding compound and indexing means operative to position said molding sections of the substrate relative to the molding device for encapsulation.

Sectional molding system

A system is proposed for encapsulating in plastics material leadframe items comprising an IC wired to a leadframe. Dust of the plastics material is removed from the encapsulation system, and in particular from those items where dust principally accumulates, such as the surfaces of the molds. To reduce the level of dust which enters the molding region, the path along which the leadframe items are conveyed to the molding region is closed at times when the leadframe items are not being transported there. Additionally, the leadframe items are conveyed to the molding region under a cover including a vacuum source, so that the dust is continually sucked away from them.

Method for encapsulating leadframe-mounted integrated circuits

A method of detaching a film of material ( ) from the surface ( ) of a substrate ( ). An outlet ( ) of a fluid delivery device ( ) is engaged with an aperture ( ) in the substrate ( ) from the opposite side of the substrate ( ) from the surface ( ) to which the film ( ) is attached. Fluid is passed out of the outlet ( ) and through the aperture ( ) to generate a detaching force between the film of material ( ) and the surface ( ) adjacent to the aperture ( ).

Method of detaching a film of material from a substrate

A resin body is moulded around a die located on the front surface of a lead frame, and subsequently masking tape adhered to the rear surface of the lead frame is peeled away. While the tape is peeled away, the front surface of the lead frame is clamped by a surface which contains, or which can be deformed to contain, a recess for receiving the resin body. The peeling is performed by firstly separating an edge portion of the tape from the lead frame by a diagonal motion; and subsequently moving the edge portion across the lead frame so as to peel back the tape until its adhered surface faces away from the lead frame. A retrieval plate is urged against the adhered surface, so that the adhered surface becomes adhered to the retrieval plate. This process is repeated for successive lead frames, so that a stack of masking tape sections is formed on the retrieval plate.

Growing community of inventors

Singapore, Singapore

See Yap Ong