Stmicroelectronics S.r.l.

Omron Corporation

Stmicroelectronics International N.v.

Phononic Vibes S.r.l.

Sebastiano Conti

Roberto Carminati

Enri Duqi

Takashi Kasai

Yuki Uchida

Igino Padovani

Filippo David

Shobu Sato

Matteo Perletti

Benedetto Vigna

Sonia Costantini

Mario Francesco Cortese

Bruno Murari

Domenico Giusti

Lorenzo Baldo

Silvia Adorno

Luca Lamagna

Sonia Constantini

Germano Nicollini

Flavio Francesco Villa

Carlo Valzasina

Enrico Rosario Alessi

Gabriele Gattere

Michele Vaiana

Massimiliano Merli

Sergio Pernici

Calogero Marco Ippolito

Andrea Barbieri

Luca Maggi

Mario Chiricosta

Giuseppe Bruno

Luca Molinari

Daniele Prati

Alessandro Morcelli

Igor Varisco

Yasuhiro Horimoto

Massimiliano Pesaturo

Mario Maiore

Yoshitaka Tatara

Marco Salina

Edoardo Marino

Daniele Casella

Massimo Greppi

Martino Zerbini

Alessandra Sciutti

Paolo Aranzulla

Fabiano Frigoli

Federica Barbieri

Francesco Mori

Guglielmo Roccasalvo

Marco Camerani

Stefano Caverni

Koichi Ishimoto

Shin Inuzuka

Luca D'ALESSANDRO

Valentina Paniccia'

Javier ÁNgel RAMÍREZ MARTÍNEZ

A method for testing the hermetic seal of a packaged device, which includes: a package that delimits a device chamber; and a transducer device, which is arranged within the device chamber and generates an electrical signal indicating at least one physical quantity external to the package. The testing method includes the steps of: imposing a reference pressure in the device chamber; arranging the packaged device in a testing chamber in which a testing pressure is present, different from the reference pressure; and subsequently detecting possible pressure variations within the device chamber.

Method for testing the hermetic seal of a package

A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.

Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor

A pressure sensor designed to detect a value of ambient pressure of the environment external to the pressure sensor includes: a first substrate having a buried cavity and a membrane suspended over the buried cavity; a second substrate having a recess, hermetically coupled to the first substrate so that the recess defines a sealed cavity the internal pressure value of which provides a pressure-reference value; and a channel formed at least in part in the first substrate and configured to arrange the buried cavity in communication with the environment external to the pressure sensor. The membrane undergoes deflection as a function of a difference of pressure between the pressure-reference value in the sealed cavity and the ambient-pressure value in the buried cavity.

Pressure sensor generating a transduced signal with reduced ambient temperature dependence, and manufacturing method thereof

A micro-electro-mechanical device, wherein a platform is formed in a top substrate and is configured to turn through a rotation angle. The platform has a slit and faces a cavity. A plurality of integrated photodetectors is formed in a bottom substrate so as to detect the light through the slit and generate signals correlated to the light through the slit. The area of the slit varies with the rotation angle of the platform and causes diffraction, more or less marked as a function of the angle. The difference between the signals of two photodetectors arranged at different positions with respect to the slit yields the angle.

Micro-electro-mechanical device having tiltable structure, with detection of the position of the tiltable structure

Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane, provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane, provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.

Acoustic transducer and microphone using the acoustic transducer

A MEMS acoustic transducer provided with: a substrate of semiconductor material, having a back surface and a front surface opposite with respect to a vertical direction; a first cavity formed within the substrate, which extends from the back surface to the front surface; a membrane which is arranged at the upper surface, suspended above the first cavity and anchored along a perimeter thereof to the substrate; and a combfingered electrode arrangement including a number of mobile electrodes coupled to the membrane and a number of fixed electrodes coupled to the substrate and facing respective mobile electrodes for forming a sensing capacitor, wherein a deformation of the membrane as a result of incident acoustic pressure waves causes a capacitive variation of the sensing capacitor. In particular, the combfingered electrode arrangement lies vertically with respect to the membrane and extends parallel thereto.

MEMS acoustic transducer with combfingered electrodes and corresponding manufacturing process

A MEMS device is provided with: a supporting base, having a bottom surface in contact with an external environment; a sensor die, which is of semiconductor material and integrates a micromechanical detection structure; a sensor frame, which is arranged around the sensor die and is mechanically coupled to a top surface of the supporting base; and a cap, which is arranged above the sensor die and is mechanically coupled to a top surface of the sensor frame, a top surface of the cap being in contact with an external environment. The sensor die is mechanically decoupled from the sensor frame.

Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process

Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.

Acoustic transducer

An oscillating structure with piezoelectric actuation includes first and second torsional elastic elements constrained to respective portions of a fixed supporting body and defining an axis of rotation. A mobile element is positioned between, and connected to, the first and second torsional elastic elements by first and second rigid regions. A first control region is coupled to the first rigid region and includes a first piezoelectric actuator. A second control region is coupled to the second rigid region and includes a second piezoelectric actuator. The first and second piezoelectric actuators are configured to cause local deformation of the first and second control regions to induce a torsion of the first and second torsional elastic elements.

Oscillating structure with piezoelectric actuation, system and manufacturing method

A MEMS sensor, in particular a microphone, of a piezoelectric type, formed in a membrane of semiconductor material accommodating a compliant portion, which extends from a first surface to a second surface of the membrane. The compliant portion has a Young's modulus lower than the rest of the membrane. A sensitive region having piezoelectric material extends on the first surface, over the compliant portion and is fixed at its ends to the membrane on opposite sides of the compliant portion. A third area of the membrane, arranged between the compliant portion and the second surface, forms a hinge element.

Piezoelectric MEMS sensor, such as force, pressure, deformation sensor or microphone, with improved sensitivity

A mirror micromechanical structure has a mobile mass carrying a mirror element. The mass is drivable in rotation for reflecting an incident light beam with a desired angular range. The mobile mass is suspended above a cavity obtained in a supporting body. The cavity is shaped so that the supporting body does not hinder the reflected light beam within the desired angular range. In particular, the cavity extends as far as a first side edge wall of the supporting body of the mirror micromechanical structure. The cavity is open towards, and in communication with, the outside of the mirror micromechanical structure at the first side edge wall.

Mirror micromechanical structure and related manufacturing process

A microelectromechanical device includes: a substrate; a semiconductor die, bonded to the substrate and incorporating a microstructure; an adhesive film layer between the die and the substrate; and a protective layer between the die and the adhesive film layer. The protective layer has apertures, and the adhesive film layer adheres to the die through the apertures of the protective layer.

Microelectromechanical device with protection for bonding

Micro-electro-mechanical device having a tiltable structure, with detection of the position of the tiltable structure

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Pregnana Milanese, Italy

Sebastiano Conti