Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Sebastian Zarwell

Andreas Kirbs

Birgit Beck

Christian Wendeln

Kilian Klaeden

Kevin-Sigurt Gottschalk

Edith Steinhäuser

Roman-David Kulko

Anna Peter

Mayumi Nishikido

The present invention relates to a method for monitoring the total amount of sulphur containing compounds in a metal or metal alloy plating bath, wherein the sulphur containing compounds contain at least one sulphur atom having an oxidation state below +6, the method comprising the steps (a), (b), optionally (c), and (d). Said method is a means of providing control over a metal plating process. Thus, the present invention relates furthermore to a controlled process for plating a metal on a substrate utilizing the method of the present invention for monitoring the total amount of said sulphur containing compounds.

Method for monitoring the total amount of sulphur containing compounds in a metal plating bath

An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, including copper ions; a reducing agent; a complexing agent for copper ions; wherein the bath further includes at least one compound according to formula (1): 

Electroless copper or copper alloy plating bath and method for plating

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Berlin, Germany

Sebastian Zarwell