Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Sebastian Taeger

Karl Engl

Markus Maute

Robert Walter

Johannes Stocker

Alfred Lell

Siegfried Herrmann

Michael Huber

Korbinian Perzlmaier

Lutz Höppel

Ion Stoll

Franz Eberhard

Adrian Stefan Avramescu

Fabian Kopp

Jens Ebbecke

Hans-Christoph Gallmeier

Stefanie Rammelsberger

Alexander Behres

Sophia Huppmann

Gudrun Lindberg

Alexander Bachmann

Martin Welzel

Rainer Hartmann

Stefan Hartauer

Johann Eibl

Georg Hartung

An electromagnetic radiation emitting device and a method for applying a converter layer to an electromagnetic radiation emitting device are disclosed. In an embodiment, a method includes applying converter elements to a surface of a carrier, applying the converter elements to an electromagnetic radiation emitting device by applying the carrier to the electromagnetic radiation emitting device such that the surface of the carrier with the applied converter elements faces the electromagnetic radiation emitting device and forming a converter layer on the electromagnetic radiation emitting device by depositing a plurality of thin layers on the converter elements using an atomic layer deposition process.

Electromagnetic radiation emitting device and method of applying a converter layer to an electromagnetic radiation emitting device

A laser diode chip has a laser facet, which includes a coating. The coating includes an inorganic layer and an organic layer. In one example, the coating has a number of inorganic layers, including a heat-conductive layer. For example, the inorganic layers may form a reflection-increasing or reflection-decreasing layer sequence.

Laser diode chip having coated laser facet

A semiconductor laser diode and a method for manufacturing a semiconductor laser diode are disclosed. In an embodiment a semiconductor laser diode includes an epitaxially produced semiconductor layer sequence comprising at least one active layer and a gallium-containing passivation layer on at least one surface region of the semiconductor layer sequence.

Semiconductor laser diode and method for manufacturing a semiconductor laser diode

A method for exposing side surfaces of a semiconductor body is disclosed. In an embodiment a method includes providing the semiconductor body having a laterally extending first main surface, forming a plurality of vertical side surfaces by partially removing material of the semiconductor body and thereby removing the first main surface in places, wherein each of the side surfaces forms an angle (&#x3b1;) between 110&#xb0; and 160&#xb0; inclusive with the remaining first main surface, applying a protective layer onto the semiconductor body so that, in a plan view, the protective layer completely covers the remaining first main surface and the obliquely formed side surfaces and partially removing the protective layer so that the protective layer is removed in regions on the obliquely formed side surfaces because of an inclination and remains at least partially preserved in regions on the remaining first main surface during a common process operation.

Method for the self-adjusted exposure of side surfaces of a semiconductor body

The invention relates to an optoelectronic semiconductor chip (), comprising an n-doped semiconductor layer (), a p-doped semiconductor layer () and an active layer () arranged between the n-doped semiconductor layer () and the p-doped semiconductor layer (), wherein the p-doped semiconductor layer () has an electrically conductive layer () arranged above it that is set up for making electrical contact with the p-doped semiconductor layer (), wherein a lateral edge () is arranged laterally with respect to the n-doped semiconductor layer (), the p-doped semiconductor layer () and the active layer (), wherein the lateral edge () has at least two oblique edge portions, wherein a first edge portion () has at least areas arranged laterally with respect to the p-doped semiconductor layer (), wherein a second lateral edge () has at least areas arranged laterally with respect to the n-doped semiconductor layer (), wherein the angle of the first edge portion () in relation to the active layer () is shallower than the angle of the second edge portion (), and wherein the electrically conductive layer () is at a lateral distance from the lateral edge ().

Optoelectronic semiconductor chip and method for fabricating an optoelectronic semiconductor chip

A semiconductor laser diode is specified, comprising a semiconductor layer sequence () with semiconductor layers applied vertically one above another with an active layer (), which emits laser radiation via a radiation coupling-out surface during operation, wherein the radiation coupling-out surface is formed by a side surface of the semiconductor layer sequence (), and a heat barrier layer () and a metallic contact layer () laterally adjacent to one another on a main surface () of the semiconductor layer sequence (), wherein the heat barrier layer () is formed by an electrically insulating porous material (). As a result, the heat arising during operation is conducted via the p-type electrode () to a heat sink () and the formation of a two-dimensional temperature gradient is avoided. A thermal lens in the edge emitter is thus counteracted. Furthermore, a method for producing a semiconductor laser diode and a semiconductor laser diode arrangement are specified.

Semiconductor laser diode, method for producing a semiconductor laser diode and semiconductor laser diode arrangement

An optoelectronic semiconductor chip is disclosed. In an embodiment the optoelectronic semiconductor chip includes a semiconductor body of semiconductor material, a p-contact layer and an n-contact layer. The semiconductor body includes an active layer intended for generating radiation. The semiconductor body includes a p-side and an n-side, between which the active layer is arranged. The p-contact layer is intended for electrical contacting the p-side. The n-contact layer is intended for electrical contacting the n-side. The n-contact layer contains a TCO layer and a mirror layer, the TCO-layer being arranged between the n-side of the semiconductor body and the mirror layer.

Optoelectronic semiconductor chip

A method can be used for fixing a matrix-free electrophoretically deposited layer on a semiconductor chip. A semiconductor wafer has a carrier substrate and at least one semiconductor chip. The at least one semiconductor chip has an active zone for generating electromagnetic radiation. At least one contact area is formed on a surface of the at least one semiconductor chip facing away from the carrier substrate. A material is electrophoretically deposited on the surface of the at least one semiconductor chip facing away from the carrier substrate in order to form the electrophoretically deposited layer. Deposition of the material on the at least one contact area is prevented. An inorganic matrix material is applied to at least one section of a surface of the semiconductor wafer facing away from the carrier substrate in order to fix the material on the at least one semiconductor chip.

Method for fixing a matrix-free electrophoretically deposited layer on a semiconductor chip for the production of a radiation-emitting semiconductor component, and radiation-emitting semiconductor component

An optoelectronic semiconductor chip includes a semiconductor body with an active region provided for generating electromagnetic radiation, a first mirror layer provided for reflecting the electromagnetic radiation, a first encapsulation layer formed with an electrically insulating material, and a carrier provided for mechanically supporting the first encapsulation layer, the first mirror layer and the semiconductor body. The first mirror layer is arranged between the carrier and the semiconductor body. The first encapsulation layer is arranged between the carrier and the first mirror layer. The first encapsulation layer is an ALD layer.

Optoelectronic semiconductor chip encapsulated with an ALD layer and corresponding method for production

A method of encapsulating an optoelectronic device includes providing a surface intended to be encapsulated, the surface containing platinum, generating reactive oxygen groups and/or reactive hydroxyl groups on the surface, and depositing a passivation layer by atomic layer deposition on the surface.

Method of encapsulating an optoelectronic device and light-emitting diode chip

An optoelectronic semiconductor chip includes a semiconductor body of semiconductor material, a p-contact layer and an n-contact layer. The semiconductor body includes an active layer intended for generating radiation. The semiconductor body includes a p-side and an n-side, between which the active layer is arranged. The p-contact layer is intended for electrical contacting the p-side. The n-contact layer is intended for electrical contacting the n-side. The n-contact layer contains a TCO layer and a mirror layer, the TCO-layer being arranged between the n-side of the semiconductor body and the mirror layer.

A thin-film encapsulation for an optoelectronic semiconductor body includes a PVD layer deposited by a PVD method, and a CVD layer deposited by a CVD method, wherein the CVD layer is applied directly on the PVD layer, and the CVD layer is etched back such that the CVD layer only fills weak points in the PVD layer.

Thin-film encapsulation, optoelectronic semiconductor body comprising a thin-film encapsulation and method for producing a thin-film encapsulation

A radiation-emitting component includes a carrier, a semi-conductor chip arranged on the carrier, wherein the semi-conductor chip includes an active layer to generate electromagnetic radiation and a radiation exit surface, a first and a second contact structure for the electrical contacting of the semi-conductor chip, a first and a second contact layer, wherein the semi-conductor chip is electrically conductively connected to the first contact structure via the first contact layer and to the second contact structure via the second contact layer, a passivation layer arranged on the semi-conductor chip.

Growing community of inventors

Bad Abbach, Germany

Sebastian Taeger