At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Sebastian Sattler

Erich Schlaffer

Bernhard Reitmaier

Gerald Weidinger

Christian Vockenberger

Gerald Weis

Markus Kastelic

Patrick Lenhardt

Patrick Fleischhacker

Heinrich Trischler

Ahmad Bader Alothman Alterkawi

Fabrizio Gentili

Wolfgang Bösch

Simon Pressler

A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and a microwave structure embedded at least partially in the stack. The microwave structure configured for exciting a microwave propagation mode and having at least two stack pieces being interconnected with each other at an electrically conductive connection interface.

Component carrier for microwave applications with stack pieces interconnected at an electrically conductive connection interface

A component carrier includes a first stack having at least one first electrically insulating layer structure and at least one first electrically conductive layer structure, and a second stack with at least one second electrically insulating layer structure and at least one second electrically conductive layer structure. The first stack and the second stack are connected with each other so that a vertical two-dimensional electrically conductive connection is established. The first stack has a first cavity and the second stack has a second cavity, the first cavity and the second cavity being separated by at least one further electrically insulating layer structure. At least one of the first cavity and the second cavity is delimited by a wall being at least partially lined with an electrically conductive coating.

Electrically connected component carrier stacks with respective cavities and method of manufacturing the same

A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace. A method of manufacturing the component carrier is also described.

Component carrier and method of manufacturing a component carrier

A drive device includes a component carrier with a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a cavity formed in the stack. A driven body is arranged at least partially in the cavity and configured for being drivable to move relative to the component carrier. At least one drive coil for creating a magnetic drive field and at least one drive magnet interacts with the magnetic drive field created by the at least one drive coil to generate a force for moving the driven body relative to the component carrier. One of the at least one drive magnet and the at least one drive coil forms part of the component carrier and the other one of the at least one drive magnet and the at least one drive coil forms part of the driven body.

Component carrier with cavity accommodating at least part of driven body being magnetically drivable to move

A component carrier includes i) a first layer stack having a first electrically conductive layer structure and/or at least one first electrically insulating layer structure, ii) a component embedded in the first layer stack, iii) a second layer stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and iv) a thermally conductive block embedded in the second layer stack. Hereby, the first layer stack and the second layer stack are connected with each other so that a thermal path from the embedded component via the thermally conductive block up to an exterior surface of the component carrier has a minimum thermal conductivity of at least 7 W/mK, in particular at least 40 W/mK. Further, a method of manufacturing the component carrier is described.

Component carrier with an embedded thermally conductive block and manufacturing method

An electronic device and a method for manufacturing such an electronic device are described. The electronic device includes an electronic component, and a component carrier in which the electronic component is embedded. The component carrier includes a first component carrier part having a first cut-out portion and a second component carrier part having a second cut-out portion, the first cut-out portion and the second cut-out portion facing opposite main surfaces of the electronic component. An electrically conductive material is provided on the surface of the first cut-out portion and on the surface of the second cut-out portion. The first cut-out portion and the second cut-out portion respectively form a first cavity and a second cavity on opposite sides of the electronic component.

Electronic device having first and second component carrier parts with cut-outs therein and adhesively joined to form a cavity that supports an electronic component therein

A component carrier including: i) a layer stack with at least one electrically insulating layer structure and at least one electrically conductive layer structure, ii) a cavity formed in the layer stack, iii) a dielectric element at least partially placed in the cavity, wherein the dielectric element and the layer stack are electromagnetically couple-able, and iv) an electrically insulating connection material between the dielectric element and the layer stack.

Component carrier with a dielectric element placed in a cavity and a manufacturing method

A component carrier with a first stack and a second stack. The first stack includes at least one first electrically insulating layer structure and at least one first electrically conductive layer structure having a first connection body with a first exposed planar electrically conductive surface. The second stack includes at least one second electrically insulating layer structure and at least one second electrically conductive layer structure having a second connection body with a second exposed planar electrically conductive surface. The first stack and the second stack are connected with each other so that the first exposed planar electrically conductive surface and the second exposed planar electrically conductive surface are connected to establish a vertical two-dimensional electrically conductive connection.

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Sebastian Sattler