Osram Gmbh

Osram Beteiligungsverwaltung Gmbh

Osram Beteiliungsverwaltung Gmbh

Sebastian Jooss

Gerhard Behr

Philipp Helbig

Michael Beck

In an embodiment a LED chip insert for a printed circuit board includes a lead frame in which a number of electrically conductive strings with respective ends are formed by punching, the strings having support surfaces which are configured for mounting on the printed circuit board and which form a common plane, wherein the lead frame has a region formed as a recess with respect to the ends, an injection molded frame including an electrically insulating material and annularly surrounding a surface of the lead frame exposed within the region formed as the recess facing the ends of the strings, and thereby effecting an overall trough-like structure; and at least one LED chip which is placed in the region formed as the recess and has a first electrical contact terminal and a second electrical contact terminal, the first electrical contact terminal being electrically conductively connected to a first one of the strings and the second electrical contact terminal being electrically conductively connected to a second one of the strings.

LED chip insert, lighting device, lighting module, and method of manufacturing the lighting device

A method for controlling at least two light-emitting diodes connected in series of a circuit assembly of a lighting device may include supplying the light-emitting diodes with a specifiable current by means of a controllable current source unit. The method may include connecting a bypass element in parallel with at least one of the light emitting diodes. The method may include detecting an electric supply voltage to the series circuit of the light-emitting diodes and the current source circuit, and controlling an electric conductivity of the bypass element based on the detected electric supply voltage and/or the light-emitting diode current.

Controlling at least two series-connected light-emitting diodes of a lighting device

A lighting device includes at least one semiconductor light source, at least one incandescent filament configured to emit electromagnetic radiation when energized, and a carrier supporting both the semiconductor light source and the incandescent filament. A screen is defined by the carrier between the semiconductor light source and the incandescent filament, so as to shield the semiconductor light source from the electromagnetic radiation emitted by the incandescent filament. The incandescent filament connected in series with the at least one semiconductor light source.

Lighting device having semiconductor light source and at least one incandescent filament

An electronic assembly for lighting applications. The assembly includes a printed circuit board (PCB) having a first PCB surface, which is designed for populating with electronic components, and a second PCB surface opposite the first PCB surface. The PCB has a continuous cutout from the first PCB surface to the second PCB surface. The electronic assembly further includes a heat distributor having at least one first contact surface and at least one second contact surface opposite the first contact surface. The first contact surface is connected in a material-bonded manner to the PCB arranged in parallel therewith at the second printed circuit board surface. The electronic assembly further includes at least one first light emitting diode element, which is arranged on a section of the first contact surface, which section is exposed within the cutout, and is connected in a material-bonded manner to the first contact surface.

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Dettingen, Germany

Sebastian Jooss