Heraeus Deutschland Gmbh & Co Kg

Heraeus Precious Metals North America Conshohocken LLC

Umicore, S.a.

Sebastian Fritzsche

Jürgen Schulze

Jörg Trodler

Dan V Goia

Bernd Kempf

Peter Braumann

Ryan Persons

Jens Nachreiner

Alexander Brand

Tanja Dickel

Markus Koenig

Thierry Charles Simon Vandevelde

Lei Wang

Steffan Käss

Joachim Wiese

Katja Stenger

Jan Strüben

Janine Staab

Daniel Hanselmann

Solder paste consisting of 85 to 92% by weight of a tin-based solder and 8 to 15% by weight of a flux, wherein the flux comprises

Solder paste

A process for forming an electric heater comprising the steps:

Process for forming an electric heater

A method for making a firmly-bonded connection involves a) providing an electronic component and a substrate having surfaces to be connected; b) applying a copper paste onto at least one of the surfaces and drying the layer of copper paste; c1) applying a solder agent onto the copper paste and arranging the component and the substrate in contact via the combination of copper paste and solder agent; or c2) arranging the component and the substrate in contact via the dried copper paste, and applying a solder agent next to the layer of dried copper paste; and d) soldering the arrangement. The copper paste contains (i) particles of copper, copper-rich copper/zinc alloy, and/or copper-rich copper/tin alloy containing a phosphorus fraction of 0 to &#x2264;500 wt-ppm, (ii) solder particles which are tin, tin-rich tin/copper alloy, tin-rich tin/silver alloy, and/or tin-rich tin/copper/silver alloy, and (iii) vehicle.

Method for producing a soldered connection

A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of &#x3e;0 to &#x2264;500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is &#x2264;15 &#x3bc;m.

A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.

Solder paste with oxalic acid and amine component

The invention is directed to a process for manufacture of fine precious metal containing particles, specifically silver-based particles and silver-based contact materials via an intermediate silver(+1)-oxide species. The process comprises in a first step the formation of a thermally instable silver (+1)-oxide species by adding a base to an aqueous silver salt solution comprising an organic dispersing agent. Due to the presence of the organic dispersing agent, the resulting silver (+1)-oxide species is thermally instable, thus the species is decomposing to metallic silver at temperature lower than 100&#xb0; C. The process optionally may comprise the addition of a powdered compound selected from the group of inorganic oxides, metals, and carbon-based compounds. Furthermore the process may contain additional separating and drying steps. The process is versatile, cost efficient and environmentally friendly and is used for the manufacture of silver-based particles and electrical contact materials. Silver nanoparticles made according to the process are characterized by a narrow particle size distribution. Electrical contact materials manufactured according to the process reveal improved contact welding properties.

Process for manufacture of silver-based particles and electrical contact materials

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Hanau, Germany

Sebastian Fritzsche