Pink Gmbh Thermosysteme

Sebastian Clärding

Christoph Oetzel

A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable.

Heat transfer device for producing a soldered connection of electrical components

A heat transfer device for thermal coupling of a component to be soldered, having a heat source and/or a heat sink in a soldering machine, with at least one base plate which is designed to be in thermal contact at least with the heat source and/or the heat sink. The base plate has a plurality of contact units having a respective contact surface, where the contact surfaces are thermally contactable to the components. The contact units are designed in such a way that the relative distances between the contact surfaces and the surface of the base plate facing the component are changeable. A soldering device, in particular a vacuumable soldering device, is provided having at least one such heat transfer device.

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Würzburg, Germany

Sebastian Clärding