Motorola Corporation

Sean Xin Wu

Karl W Wyatt

Chao-pin Yeh

Jang-Hun (James) Yeh

Daniel Roman Gamota

Chowdary Ramesh Koripella

James J Morikuni

Alan G Chen

George Amos Carson

Gary K Mui

Wen Xu Zhou

Brian J Bullock

Danniel Roman Gamota

The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apertures to accommodate solder joints to the top surface of the circuit board to facilitate solder attachment of the connection pads to the electronic elements wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.

Device for reworkable direct chip attachment

The present invention provides a method, device and optical package (10,22) for enhancing a temperature stability by controlling a variable characteristic of an optical package and optical interconnect system. The device includes an optical emitter (14) for generating a predetermined beam of light (16) having a predetermined wavelength, a photo-sensing unit (20) for receiving a portion (18) of the predetermined beam of light (16), and a stability-enhancing broad bandwidth holographic optical element (12), wherein the predetermined wavelength of the predetermined beam of light substantially coincides with a working range wavelength of a broad bandwidth of the stability-enhancing broad bandwidth holographic optical element (12), for enhancing the temperature stability of the optical package and the optical interconnect system in response to changes in a thermal expansion of the stability-enhancing broad bandwidth holographic optical element (12) and the changes in the predetermined wavelength of the predetermined optical beam caused by temperature variations.

Method, device and optical package with enhanced temperature stability

The present invention provides a method, article of manufacture, and optical package (24) for eliminating tilt angle (40) between an optical emitter (26) mounted on a carrier (28). The method, article of manufacture, and optical package (24) include a carrier (28) having a top surface (42) with a cavity (46) formed therein, an adhesive material (38) inserted into the cavity (46), and an optical emitter (26) placed on the top surface (42) of the carrier (28) and at least partially covering the cavity (46), thereby providing at least one egress point for overflowing said adhesive material therefrom.

Method, article of manufacture, and optical package for eliminating tilt

The present invention provides a low cost, efficient vertical cavity surface emitting laser package (300) and manufacturing method, the package having a head assembly having at least three leads, a vertical cavity surface emitting laser die bonded to a top surface of the head assembly, for generating a beam of light, and a photodiode, die bonded to the top surface of the head assembly proximate to the vertical cavity surface emitting laser for receiving at least a portion of the beam of light, and generating feedback for adjusting an electrical input current to the vertical cavity surface emitting laser based on a received optical power of the portion of the beam of light received. The vertical cavity surface emitting laser and the photodiode are injection molded in a predetermined shape with a recessed area for placement of a partially reflective holographic optical element/reflector.

Low cost, efficient vertical cavity surface emitting laser package,

A microelectronic assembly (10) includes an integrated circuit component (14) attached to a polymeric substrate (12) by a plurality of unencapsulated solder bump interconnections (16). A collar (18) is affixed to the polymeric substrate (12) about the integrated circuit component (14) and is formed of an inorganic material having a coefficient of thermal expansion less than that of the substrate (12). The collar (18) constrains thermal expansion of the polymeric substrate (12) in the die attach region (22), thereby lessening any deleterious effects caused by a mismatch in the thermal expansion of the polymeric substrate (12) and the integrated circuit component (14).

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Palatine, IL, United States of America

Sean Xin Wu