Intel Corporation

Sean T Sivapalan

Jeffory L Smalley

David Shia

Ralph V Miele

Phil Geng

Eric W Buddrius

Mengqi Liu

Olaotan Elenitoba-Johnson

An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.

Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention

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Portland, OR, United States of America

Sean T Sivapalan