Cyrix Corporation

Augat Inc.

International Business Machines Corporation

Olin Corporation

Sean T Crowley

Thomas D Selgas

Stephen D DelPrete

Donald Santos

Kerry D Arnold

Paul R Hoffman

Keshav B Prasad

Thomas Caulfield

Paul J Pascarelli

An electronic package with a semiconductor chip, a lead frame, a metal casing, and a redistribution interposer. The chip is mounted on the interposer and wirebonded to first ends of redistribution leads of the interposer. The redistribution leads have second ends orientated in a general flipped orientation relative to their corresponding first ends. The second ends are wirebonded to pads of the lead frame. The interposer allows smaller chips to be used in the package without changing the lead frame. The interposer also allows the chip to be flip-mounted in the package without changing the lead frame or casing, this allows redirection of the chip's thermal path.

Semiconductor package with chip redistribution interposer

An integrated circuit extraction tool includes an elongated base having a first end and second end. A first set of teeth are provided on the first end and a second set of teeth are provided on the second end. The first set of teeth are spaced at a first spacing distance and the second set of teeth are spaced at a second spacing distance. In the preferred embodiment, the first set of teeth are spaced to correspond with the spacing between pins of a integrated circuit to be extracted and the second set of teeth are spaced at a distance to correspond to the spacing between base portions of a socket's connectors. One or both of the ends may be angled at ninety degrees to allow integrated circuit removal with minimal clearance.

Integrated circuit extraction tool

A component carrier and mating system is disclosed for aligning and mating closely spaced leads of integrated circuit (IC) packages, which protects the integrated circuit packages and permits easy installation. The system is particularly adapted for aligning and mating integrated circuits which have high pin counts. A carrier assembly aligns for mating and interconnecting at least two integrated circuit packages having a plurality of leads extending from the packages. A protective shroud covers the stacked packages to maintain the packages in electrical and mechanical engagement and to assure that no damage occurs to the integrated circuit packages. In one embodiment, a first package is installed on the carrier assembly and coupled with the protective shroud to form a pre-engagement assembly, the pre-engagement assembly is then engaged with a second package mounted on a printed circuit board. An extraction tool facilitates disengagement of the assembly from the second package mounted on the printed circuit board.

Stackable interconnection socket

Growing community of inventors

Plano, TX, United States of America

Sean T Crowley