Samsung Electronics Co., Ltd.

Sean Park

Ken Ozawa

Jae-min Lee

Kwang-soo Kim

Sung-Won Park

Mitsunori Numata

Ji-hoon Kang

Akio Ishikawa

Myung-Ho Jung

Inspection system for a device under test (DUT) includes an image sensor, N image obtaining devices, K switches, M image processing devices, and at least one added image processing device. The image obtaining devices are connected to the image sensor, and each of the N image obtaining devices receives image data of the image of the DUT captured by the image sensor. Each of the K switches is connected to a respective one of the image obtaining devices. Each of the M image processing devices is connected to a respective one of the switches, receives the image data that is output from one of the N image obtaining devices and is distributed by one of the K switches, and generates processed image data in real-time. The added image processing device is connected to one of the switches, receives the image data, and generates additional processed image data in real-time.

System and method of inspecting device under test, and method of manufacturing semiconductor device

An imaging apparatus includes an illumination light source to output an illumination light, an illumination optical system to transmit the illumination light toward a sample, an imaging optical system to transmit light reflected from the sample, a stage to move the sample in a predetermined transfer direction, and a photographing unit to receive the reflected light. The imaging apparatus may include one or more diffraction grids located at conjugate focal planes of the sample. The operation of the photographing unit may be synchronized with a movement of the sample by the stage to obtain an image in accordance with a time delay integration method.

Imaging apparatus and imaging method

Growing community of inventors

Yongin-si, South Korea

Sean Park