Apple Inc.

Sean P Shannon

Patrick S Wieler

Charissa Rujanavech

Dan Powell

Jason Schwarz

David Novak

Darragh Staunton

Thomas Loeper

John Sever

Roy Mahalas

James Fikert

According to some embodiments, a method operable by an electronic component recovery system for detaching an electronic component adhesively bonded to a housing by way of an adhesive bond, is described. The electronic component is carried within a cavity defined by the housing of a portable electronic device. The method can include while the housing having the electronic component attached thereto is located at an electronic component detaching module, where the electronic component detaching module includes a movable arm capable of rotating about a hinge: cooling the housing and the electronic component attached thereto to a temperature that is low enough to weaken the adhesive bond, and causing the movable arm to rotate about the hinge such that a portion of the housing strikes a detachment element with sufficient force to separate the electronic component from the housing.

Modular system for automated portable electronic device disassembly

According to some embodiments, a method for processing an electronic component associated with a portable electronic device by a conveyor system subsequent to removing the electronic component from a housing of the portable electronic device, where the conveyor system includes a container that is capable of carrying the electronic component, is described. The method can include depositing, at a receiving station of the conveyor system, the electronic component within a cavity of the container. The method can further include while moving the container that carries the electronic component from the receiving station in a direction towards a removal station of the conveyor system: monitoring a temperature of the electronic component, and in response to determining that the temperature of the electronic component exceeds a temperature threshold range associated with a thermal event: cooling the electronic component by dissipating thermal energy associated with the thermal event.

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San Francisco, CA, United States of America

Sean P Shannon