Elux, Inc.

Sharp Kabushiki Kaisha Corporation

Corning Incorporated

Sean Mathew Garner

Paul John Schuele

Mark Albert Crowder

Changqing Zhan

David Robert Heine

Avinash Tukaram Shinde

Timothy James Kiczenski

Kurt M Ulmer

Kenji Alexander Sasaki

Michael Lesley Sorensen

A fluidic assembly method is provided that uses a counterbore pocket structure. The method is based upon the use of a substrate with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface. The method flows an ink with a plurality of objects over the substrate top surface. As noted above, the objects may be micro-objects in the shape of a disk. For example, the substrate may be a transparent substrate and the disks may be light emitting diode (LED) disks. Simultaneously, a suction pressure is created at the substrate bottom surface. In response to the suction pressure from the through-holes, the objects are drawn into the counterbore pocket structures. Also provided is a related fluidic substrate assembly.

Counterbore pocket structure for fluidic assembly

Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Diodes offering asymmetric stability during fluidic assembly

Embodiments are related to systems and methods for forming and using a top-contact disk.

Fluidic assembly top-contact LED disk

Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate. In some cases, embodiments include a substrate including a plurality of wells each having a sidewall where a through hole via extends from a bottom of at least one of the plurality of wells; and a post enhanced diode including a post extending from a top surface of a diode structure.

Substrate features for enhanced fluidic assembly of electronic devices

A method is provided for forming a direct emission display. The method provides a transparent substrate with an array of wells formed in its top surface. A fluid stream is supplied to the substrate top surface comprising a plurality of top-contact light emitting diode (LED) disks. The wells are filled with the LED disks. A first array of electrically conductive lines is formed over the substrate top surface to connect with a first contact of each LED disk, and a second array of electrically conductive lines is formed over the substrate top surface to connect with a second contact of each LED disk. An insulator over the disk exposes an upper disk (e.g., p-doped) contact region. A via is formed through the disk, exposing a center contact region of a lower (e.g., n-doped) disk contact region. Also provided are a top-contact LED disk and direct emission display.

Embodiments are related to fluidic assembly and, more particularly, to systems and methods for forming physical structures on a substrate.

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Elmira, NY, United States of America

Sean Mathew Garner