3m Innovative Properties Company

Sean M Tsuji

David J Plaut

Chin Teong Ong

Siang Kwang Lee

A low temperature curable epoxy tape is provided that can be useful as a semi-structural adhesive tape in the automotive, aerospace, and electronics industries to form metal-to-metal and metal-to-plastic bonds. The provided epoxy tape includes a curative layer. The curative layer includes a scrim, a binder layer at least partially enclosing the scrim, and a latent curative dispersed in the binder layer. The curative layer is coated and then dried of solvent. Then an epoxy layer is laminated to a top and a bottom of the curative layer. The epoxy tape is placed between two parts being bonded together and then heated to temperatures of bottom up to about 110&#xb0; C. to activate and disperse the active curative. A semi-structural bond is formed. Also, a method of making the epoxy tape is provided.

Growing community of inventors

Tokyo, Japan

Sean M Tsuji