Apple Inc.

Sean M Gordoni

David A Karol

Daniel J Morizio

Matthew D Hill

Benjamin J Pope

Sawyer Isaac Cohen

Lucy Elizabeth Browning

Eric N Nyland

Jian Guo

Ihtesham H Chowdhury

Devon A Monaco

Sherry Lee

Arun R Varma

Bryan D Keen

Nicholas W Ruhter

James W Bilanski

Abhishek Choudhury

Zhong J Ma

Yaodong Wang

An assembly is provided that includes a printed circuit board, a transceiver integrated circuit mounted on a first surface of the printed circuit board, and an antenna module having multiple antennas and that is mounted on a second surface of the printed circuit board. The antenna module at least partially overlaps with the transceiver integrated circuit in an overlap region. The antenna module is electrically coupled to the transceiver integrated circuit via direct passthrough signal connections that extend from the first surface to the second surface. The direct passthrough signal connections are located within the overlap region. Each of the direct passthrough signal connections can be implemented using through-board stacked via structures. The antenna module can include multiple layers of signal routing lines for distributing the signals from the direct passthrough signal connections to the various antennas on the antenna module.

Printed circuit board with passthrough signal connections between a radio-frequency system and an antenna module

A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.

Handheld electronic device

A compensation coil placed at least partially underneath a magnetic field sensor package in an electronic system provides attenuation of electromagnetic interference (EMI). In an embodiment, the compensation coil attenuates EMI in a frequency band which overlaps with an operating frequency band of the magnetic field sensor. This allows the magnetic field sensor to make accurate magnetic field measurements in the presence of system level alternating current (AC) EMI. In an embodiment, a system comprises: a magnetic field sensor; a compensation coil placed at least partially underneath the magnetic field sensor; and a reverse current generator coupled to the compensation coil and to a power supply that is coupled to an electromagnetic interference (EMI) source, the reverse current generator operable to generate a reverse current in the compensation coil to generate a counter magnetic field for compensating the EMI.

Compensation of magnetic interference

Growing community of inventors

Santa Clara, CA, United States of America

Sean M Gordoni