Aeroflex Colorado Springs Inc.

Cobham Colorado Springs Inc.

Sean Leighton Thorne

Scott Popelar

This application is directed to a semiconductor system including a substrate, an electronic device, a plurality of compliant interconnects and a support structure. The substrate has a first surface and a plurality of first contacts formed on the first surface. The electronic device has a second surface facing the first surface of the substrate, and a plurality of second contacts formed on the second surface. The compliant interconnects are disposed between the first surface of the substrate and the second surface of the electronic device, and are configured to electrically couple the first contacts on the first surface of the substrate to the second contacts on the second surface of the electronic device. The support structure is coupled to the substrate and the electronic device, and extends beyond a footprint of the electronic device. The support structure is configured to mechanically couple the electronic device to the substrate.

Flip chip assembly

A flexible semiconductor package is formed by interposing a flexible substrate between a tungsten stiffener and a die. A tungsten stiffener is bonded to a first surface of the flexible substrate prior to flip chip bonding or die attach of a die to a second surface of the flexible substrate. The tungsten stiffener is dimensioned so as to substantially overlap the die and provide a rigid and flat surface on which the die/flexible substrate bonding occurs. The flat and rigid characteristic of a tungsten stiffener optimizes the electrical and mechanical bond between the die and the flexible substrate as well as minimizing CTE mismatch.

Tungsten stiffener for flexible substrate assembly

A photodiode detector array is bonded to a first surface of a first substrate and electrically coupled to the second surface of the first substrate. A shield, opaque to X-ray radiation is attached to the second surface of the first substrate. A processing chip is flip chip bonded and electrically coupled to the first surface of the second substrate. A portion of the first surface of the second substrate is physically and electrically joined to a portion of the second surface of the first substrate so as to allow processing of electrical signals from the photodiode array. The shield associated with the first substrate is aligned so as to prevent X-ray radiation from reaching the processing chip associated with second substrate. The shield and the processing chip are separated by an air space providing thermal and electrical isolation.

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Colorado Springs, CO, United States of America

Sean Leighton Thorne