Sandia Corporation

Intel Corporation

National Technology & Engineering Solutions of Sandia, LLC

Sean J Hearne

Murat Okandan

Gregory Nolan Nielson

Grant M Kloster

William C Sweatt

Paul Charles Galambos

Anthony L Lentine

Paul Davids

Paul Gilbert Clem

Dale L Huber

Khalid Mikhiel Hattar

Jeffrey S Nelson

Andrew Jay Leenheer

Christopher Alan Apblett

Michael Shaw

Katherine L Jungjohann

William Mook

Claire Chisholm

A microelectromechanical system (MEMS) device can be used for quantitative mechanical testing of materials within a controlled (chemical and temperature) environment, with the ability for electrochemical control to the specimen, that is coupled with a complimentary in-situ characterization technique.

Active mechanical-environmental-thermal MEMS device for nanoscale characterization

A photovoltaic system described herein includes a first group of photovoltaic modules that comprises a first plurality of microsystem enabled photovoltaic modules. A second group of photovoltaic modules comprises a second plurality of microsystem enabled photovoltaic modules, wherein the first group of photovoltaic modules are electrically connected in parallel to the second group of photovoltaic modules.

Photovoltaic system

A method for making a laterally modulated metallic structure that is compositionally modulated in the lateral direction with respect to a substrate.

Lateral electrodeposition of compositionally modulated metal layers

An electroplated metal alloy including at least three elements. A multilayer interconnection structure that includes a substrate that is an interior of the interconnection structure, a conductive seed layer exterior to the substrate, and an electroplated metal alloy layer including at least three elements exterior to the conductive seed layer. A multilayer interconnection structure formed on a substrate, that includes a barrier layer, and a conductive seed layer, wherein the improvement includes an electroplated metal alloy layer including at least three elements. A method for forming a multilayer interconnection structure that includes providing a substrate, depositing a conductive seed layer, and electroplating a metal alloy layer including at least three elements exterior to the conductive seed layer.

Method for alloy-electroplating group IB metals with refractory metals for interconnections

Growing community of inventors

Albuquerque, NM, United States of America

Sean J Hearne