Qualcomm Incorporated

Sony Electronics Inc

Sean A Moran

Thomas J Chintala

Jose F Olivas

Roger William Berg

Paul J Smith

James Beckwith

A portable phone has a cavity at one end in which a hinge pin is rotatably mounted, with opposite ends of the hinge pin releasably secured to a flip panel rotatable between a closed position extending over part of one face of the phone, and an open position. The hinge pin includes a cam formation, and a biasing spring secured in the cavity has a bearing portion acting against the cam portion to releasably retain the flip panel in its open and closed positions. A cam retainer is mounted in the cavity to extend over the hinge pin and resist bending of the hinge pin out of a straight, axial orientation.

Cam retainer for flip-style portable phone

A ground connector and standoff apparatus or spring member for mounting between two circuit boards is of conductive material and has opposing substantially flat, parallel first and second legs and a spring link connecting the legs. In an uncompressed condition of the spring member, the legs are spaced apart a predetermined distance greater than the spacing between the two circuit boards when connected together. The first leg is connected to one of the circuit boards and the second leg bears against an opposing portion of the other circuit board to provide a ground connection when the boards are connected together, compressing the spring member. A limiter or spacer on the spring member limits compression beyond a predetermined point at which the height of the spring member is equal to a predetermined standoff between the boards.

Ground connection apparatus

A ground clip apparatus is designed to make ground contact between two circuit boards as they are mated together. A standoff member is mounted on one of the boards and a spring clip member is mounted on the other board facing the standoff member. The spring clip member has spring arms which are biased against the standoff member when the boards are mated together to make a reliable ground contact. At the same time, the standoff member resists deflection of either board towards the other board.

Ground clip apparatus for circuit boards

An EMI shielding apparatus has an outer peripheral wall extending around a combined area of predetermined shape and dimensions for enclosing at least two adjacent areas on a printed wiring board to be shielded from one another. A single transverse wall extends between opposing portions of the peripheral wall to divide the combined area into the two adjacent sub-areas to be shielded from one another. The single transverse wall is of single wall thickness, reducing the EMI shield footprint. The peripheral wall and transverse wall may be formed integrally as one frame, or from two or more adjacent sub-frames.

EMI shield apparatus for printed wiring board

A combined EMI shield and brace assembly has at least two frames for placing side-by-side on a printed wiring board to surround predetermined adjacent areas on the board containing components to be shielded from one another, and a brace member securing the two frames together during reflow. Each frame has a peripheral side wall forming an enclosed area of predetermined shape and dimensions and a portion of the side wall of one frame is placed against a portion of the side wall of the other frame so that the two frames together form an enlarged enclosed area divided into two sub-areas by the adjacent side wall portions extending across the enlarged area. The brace member extends over the frames and is secured to their side walls, and may secure two or more frames together.

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San Diego, CA, United States of America

Sean A Moran