Apple Inc.

Sean A Bailey

Michael D Hillman

Gregory L Tice

Perry Q Anderson

William Sauway Law

Ann Laurent Torres

Efrain Alcorta

Richard Lidio Blanco

Ronald Jack Smith

Roger R Schmidt

Theodore Gerard Van Kessel

Supratik Guha

Yves Corfield Martin

Prabjit Singh

David L Edwards

Amir Salehi

Jonathan Neal Urquhart

Anwyl M McDonald

Phillip Lee Mort

Oscar Woo

Clayton R Anderson

James M Crowder

Jeffrey J Van Norden

A display system with a distributed LED backlight includes: providing a plurality of tile LED light sources, each tile LED light source having a tile and a plurality of similar LED light sources on each tile connected for emitting light therefrom; orienting the plurality of tile LED light sources for illuminating a display from the back of the display; and integrating the plurality of tile LED light sources into a thermally and mechanically structurally integrated distributed LED tile matrix backlight light source.

Display system with distributed LED backlight

Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die.

Spray dispensing method for applying liquid metal

An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.

Thermal interface apparatus

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Menlo Park, CA, United States of America

Sean A Bailey