Lg Innotek Co., Ltd.

Se Woong Na

In Hee Cho

Hyun Gyu Park

Min Jae Kim

Man Hue Choi

Seung Kwon Hong

Bi Yi Kim

Jung Eun Han

Sung Jin Yun

Se Ho Myeong

Jae Man Park

Moo Seong Kim

Hyun Gu Im

Jong Heum Yoon

Sang A Ju

Sanga Ju

Do Hyuk Yoo

Jun Soo Park

Jina Gu

Gun Young Gil

Eui Yeol Yang

Jin A Gu

Joon Ii Cha

Jee Hee Lim

Hong Ik Kim

Sang iL Kim

A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.

Circuit board

A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on the insulating layer; and a protective layer disposed on the insulating layer and the circuit pattern, and including first and second regions having different heights; wherein the circuit pattern includes: a first-first circuit pattern corresponding to the first region of the protective layer; and a first-second circuit pattern corresponding to the second region of the protective layer, wherein a height of the first region of the protective layer is lower than a height of the first-first circuit pattern, wherein a height of the second region of the protective layer is higher than a height of the first-second circuit pattern, wherein a surface of the first-first circuit pattern includes: a first portion in contact with the first region of the protective layer, and a second portion excluding the first portion, and wherein a surface roughness Ra of the first portion is different from a surface roughness Ra of the second portion.

A circuit board including an insulating layer including a first region and a second region; a plurality of outer layer circuit patterns disposed on upper surfaces of the first region and the second region of the insulating layer; and a solder resist including a first part disposed on the first region of the insulating layer and a second part disposed on the second region of the insulating layer. The first part includes an upper surface having a curved surface and exposes an upper surface of an outer layer circuit pattern disposed on the first region of the insulating layer. The second part covers an upper surface of an outer layer circuit pattern disposed on the second region of the insulating layer, and at least a part of the upper surface of the first part is positioned lower than the upper surface of the outer layer circuit pattern.

A circuit board according to an embodiment includes: an insulating layer including first to third regions; an outer layer circuit pattern disposed on an upper surface of the first to third regions of the insulating layer; and a solder resist including a first part disposed on the first region of the insulating layer, a second part disposed on the second region, and a third part disposed on the third region, wherein the outer layer circuit pattern includes: a first trace disposed on an upper surface of the first region of the insulating layer; and a second trace disposed on an upper surface of the third region of the insulating layer; wherein a height of the first trace is different from a height of the second trace; and an upper surface of the first part of the solder resist is positioned lower than an upper surface of the first trace.

A circuit board according to an embodiment comprises: an insulating layer including first to third regions; an outer layer circuit pattern disposed on the upper surface of the first to third regions of the insulating layer; and a solder resist including a first part disposed in the first region of the insulating layer, a second part disposed in the second region, and a third part disposed in the third region, wherein the outer layer circuit pattern has a first height, the third part of the solder resist is disposed on the upper surface of the outer layer circuit pattern to have a second height, the first region includes a first sub-region and a second sub-region, the first part includes a first sub-part disposed in the first sub-region and a second sub-part disposed in the second sub-region, the upper surface of the first sub-part is located to be higher than the upper surface of the outer layer circuit pattern and lower than the upper surface of the third part, the upper surface of the second sub-part is located to be lower than the upper surface of the outer layer circuit pattern, and the surface roughness of the third part of the solder resist is different from the surface roughness of the first part of the solder resist.

A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and exposed through the cavity; wherein the second insulating layer includes a first portion disposed on an upper surface of the first insulating layer in a region where the cavity is formed; and a second portion other than the first portion, and wherein a thickness of the first portion is smaller than a thickness of the second portion.

Printed circuit board and package substrate including same

A printed circuit board according to an embodiment includes a first insulating layer; a first circuit pattern disposed on a lower surface or inside the first insulating layer; a second circuit pattern disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and surrounding the second circuit pattern; and a protective layer disposed on an upper surface of the second insulating layer, wherein the second insulating layer has at least one recess formed on its upper surface, and wherein the protective layer is disposed in the recess formed on the upper surface of the second insulating layer.

Printed circuit board

A jig for processing a via hole according to an embodiment is an auxiliary member having a plate shape disposed between a processing plate in which a suction portion is disposed at a lower portion and a workpiece, wherein the auxiliary member includes a plurality of first suction holes for sucking and supporting the workpiece by suction air provided through the suction portion, and each of the plurality of first suction holes includes a first suction hole portion extending in a first direction, and a second hole portion extending in a second direction different from the first direction, wherein the first direction is perpendicular to the second direction.

Jig for via-hole processing, via-hole processing device, and via-hole processing method using same

An inorganic filler included in an epoxy resin composition includes a coating layer formed on a surface thereof, and the surface of the coating layer includes at least two elements selected from the group consisting of C, N and O.

Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition

An inorganic filler includes surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided.

Inorganic filler and epoxy resin composition including the same

A light source circuit unit and a lighting device including the light source circuit unit that are configured such that a bent-type metal substrate is formed on an upper surface of the printed circuit board so that the occurrence of a defect due to circuit damage at a bent part upon bending the substrate can be prevented, and slimness and a heat-dissipation property of a device can be improved. The light source circuit board includes: a substrate having a first part with at least one opening portion, and a second part bent from the first part; a printed circuit board on one surface of the substrate; and a light source element mounted to the printed circuit board and inserted into the opening portion, the light source element emitting light to an opposing side of the substrate.

Light source circuit unit and lighting device comprising same

Provided are a printed circuit board a lighting unit including the printed circuit board, the printed circuit board including: a metal substrate; a light emitting element disposed on the metal substrate; and a wiring portion disposed between the light emitting element and the metal substrate.

Printed circuit board and lighting unit including the same

A circuit board, and a lighting device and board housing module having the circuit board. The circuit board includes a support substrate having a first region and a second region bent from the first region, light emitting devices disposed on the first region, and a protective support portion protruding more than the light emitting devices from the support substrate of the first region.

Circuit board and lighting device and board housing module having the circiut board

Provided is a lighting unit, including: a support substrate; a light guide plate for guiding light generated from a light source; and a first stopper fixed to the support substrate and configured to support the light guide plate.

Growing community of inventors

Seoul, South Korea

Se Woong Na