Lg Chem, Ltd

Lg Energy Solution, Ltd.

Shanjin Optoelectronics (nanjing) Co., Ltd.

Se Woo Yang

Seung Min Lee

Yoon Gyung Cho

Hyun Suk Kim

Suk Ky Chang

Hyun Jee Yoo

Sang Min Park

So Young Kim

Min Soo Park

Eun Suk Park

Jung Ok Moon

Hyoung Sook Park

Kyung Yul Bae

Yang Gu Kang

Yoon Tae Hwang

Jung Sup Shim

Young Jo Yang

Ban Seok Choi

Ji Young Hwang

Jung Woo Lee

Jae Hun Yang

Sung Jong Kim

Cha Hun Ku

Byung Kyu Jung

Jae Min Lee

Se Ra Kim

Hyo Sook Joo

Hyun Hee Son

Yong Su Park

Dong Hyun Woo

Young Gil Kim

Gyu Jong Bae

Kyoung Bin Im

Ji Yeong Lee

Jong Rok Jeon

Kyun Il Rah

Ki Seok Jang

Sung Hyun Nam

Woo Ha Kim

Seong Kyun Kang

So Ra Yoon

Si Yeon Baek

Sul Ki Han

Myung Han Lee

Jae Jin Kim

Joon Hyung Kim

Dae Han Seo

Hyun Sup Lee

Min Soo Song

Jong Hyun Jung

Yeong Bong Mok

Eun Gu Han

Kyung Su Oh

Chang Ik Song

Myung Seob Kim

Mun Sung Kim

Hyeon Sik Choi

Jae Ho Jung

Ye Hoon Im

Sang Choll Han

Jong Sung Park

Tae Hee Kim

Hye Min Yu

In Ju Mun

Yeon Soo Kim

Kum Suek Seo

Young Wook Kim

Sang Eun Kim

Yong Sung Goo

Jung Kyu Lee

The present disclosure relates to a composition for encapsulating an organic electronic element and an organic electronic device comprising the same, and provides an encapsulation composition which can form an encapsulation structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifespan of the organic electronic device and implementing endurance reliability of the encapsulation structure at high temperature and high humidity, and has high shape retainability, and an organic electronic device comprising the same.

Composition for encapsulation

An encapsulation film, an organic electronic device comprising the same, and a method for manufacturing the organic electronic device using the same, and the encapsulation film which forms a structure capable of blocking moisture or oxygen penetrating from the outside into the organic electronic device, effectively releases the heat accumulated in the organic electronic device, realizes endurance reliability under severe conditions of high temperature and high humidity, and prevents deterioration of the organic electronic device.

Encapsulation film

The present invention relates to an adhesive composition and an organic electronic device comprising the same, and provides an adhesive composition which can form a encapsulating structure capable of effectively blocking moisture or oxygen introduced from the outside into the organic electronic device, thereby securing the lifetime of the organic electronic device, and can improve processability by being easily applied in the process of forming the encapsulating structure of the organic electronic device, thereby preventing problems that air bubbles flow into the inside of the encapsulating structure or application nozzles are clogged, and an organic electronic device comprising the same.

Adhesive composition

The present disclosure relates to an encapsulation film and an organic electronic device comprising the same, which provides an encapsulation film having excellent resilience without causing plastic deformation, while having flexible and rollable characteristics, as well as implementing excellent moisture barrier characteristics, and an organic electronic device comprising the same. The encapsulation film includes an encapsulation composition which includes a block copolymer having a first block derived from a monomer having a glass transition temperature of 0° C. or higher, and a multifunctional oligomer, where, after the encapsulation film is stretched 200% (2 times the existing length) in the longitudinal direction under conditions of a temperature of 25° C. and 60% relative humidity and left for 24 hours, the degree of restoration at the time of removing the stretched force and measuring the length after 1 hour is within 110% of the existing length.

A resin composition, a method for manufacturing the same and a use thereof are provided. The resin composition provides excellent thixotropy while having one or more excellent properties selected from thermal conductivity, adhesiveness, insulation properties, tensile characteristics, hardness and flame retardancy.

Resin composition

An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (η*) of 5000 Pa·s to 10Pa·s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

Organic electronic device including encapsulation layer

The present disclosure provides an adhesive composition including an aliphatic urethane (meth)acrylate, a thickener and a spacer. The adhesive composition has printability that printing can be effectively performed into a pattern with a thin width or the like, and is capable of forming an adhesive having excellent physical properties such as transparency, a gap maintaining ability capable of maintaining a constant cell gap between films and adhesive force. The adhesive composition is useful for constituting an optical element for HMDs.

The present application relates to a resin composition, a battery module comprising a cured product of the resin composition, a manufacturing method thereof and a battery pack. According to one example of the present application, injection processability of the resin composition can be improved, overloading of injection equipment can be prevented, and the battery module having excellent insulation properties can be provided.

Resin composition and battery module comprising the same

The present application relates to a composition, a battery module and a battery pack. According to one example of the present application, there is provided a urethane-based heat dissipation material capable of providing excellent thermal conductivity and storage stability.

Provided is a composition for encapsulating an organic electronic element, comprising an olefin-based resin having at least one reactive functional group, a multifunctional acrylic oligomer, and a monofunctional acrylic oligomer, wherein the monofunctional acrylic oligomer is present in an amount of 7 to 30 parts by weight relative to 100 parts by weight of the olefin-based resin. Also provided are an organic electronic device comprising the composition, and methods for preparing the organic electronic device.

Encapsulating composition

A battery module and a method of manufacturing the same are disclosed herein. In some embodiments, a battery module includes a module case having an internal space formed by a top plate, a bottom plate and sidewalls of the module case, a plurality of battery cells disposed in the internal space, a first filler-containing cured resin layer in contact with both the top plate and the plurality of battery cells, and a second filler-containing cured resin layer in contact with both the bottom plate and the plurality of battery cells. The battery module can have excellent power relative to volume, while being manufactured in a simple process and at a low cost.

Battery module with filler-containing cured resin layers

The present application provides an encapsulation film comprising an encapsulation layer, a metal layer, and a protective layer. The encapsulation film provides a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, minimizes the appearance change of the film due to excellent handling properties and processability, and prevents physical and chemical damage during encapsulation process.

Encapsulation film including metal layer and protective layer with resin component

The present application relates to a composition, a battery module and a battery pack. According to one example of the present application, it is possible to provide a battery module and a battery pack which have improved heat dissipation properties, adhesive force, adhesion reliability and processability as well as excellent power to volume.

The present application relates to an adhesive composition capable of fixing a battery cell in a battery module and a battery pack. According to one example of the present application, there is provided a two-component urethane-based adhesive composition which has excellent storage stability and processability and is capable of providing physical properties required in related uses in a short time.

The present application relates to a composition, a battery module and a battery pack. According to one example of the present application, the related manufacturing process can be improved and a battery module having excellent insulation can be provided.

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Daejeon, South Korea

Se Woo Yang