Lg Chem, Ltd

Lg Energy Solution, Ltd.

Se Ra Kim

Kwang Joo Lee

Jung Hak Kim

Hee Jung Kim

Young Kook Kim

Seung Hee Nam

In Cheon Han

Jung Ho Jo

Suk Ky Chang

Kee Young Kim

Hyo Sook Joo

Se Woo Yang

Sung Jong Kim

Cha Hun Ku

Yoon Tae Hwang

Ji Ho Han

Byung Kyu Jung

Sung Soo Yoon

No Ma Kim

Jung Sup Shim

Min Soo Park

Min Ki Lee

Hyo Jin Jeong

Yeong Rae Chang

Jang Soon Kim

Hyun Woo Park

Joon Hyung Kim

Kyung Ki Hong

Ju Young Kim

Hyun Hee Son

Soon Hwa Jung

Sang Ki Chun

Woo Ha Kim

Jong Wan Hong

Seung Joon Park

Jae Gwan Lee

Sung Su Kim

Mun Seop Song

Eun Sang Yoo

Ji Yeon Seong

Yeong Im Yu

Yoon Jeong Baek

Jung Sik Jo

Mun Gi Park

Jae Kwan Lee

Hyo Jin Jung

The present invention relates to a dicing die-bonding film including: a substrate; an antistatic layer formed on the substrate and including an aliphatic or alicyclic polyurethane resin and a conductive filler; a cohesive layer formed on the antistatic layer; and an adhesive layer formed on the cohesive layer, and a dicing method of a semiconductor wafer using the dicing die-bonding film.

Dicing die-bonding film

The present invention relates to an adhesive film having a thixotropic index at 110&#xb0; C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.

Adhesive film, preparation method of semiconductor device, and semiconductor device

The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.

Semiconductor device and method for manufacturing semiconductor device

The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight loss ratio at a high temperature.

Semiconductor device

The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.

Adhesive film for semiconductor

The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobornyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobornyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.

Adhesive composition, adhesive sheet, and back grinding method for semiconductor wafer

The present invention relates to an adhesive composition for a semiconductor including: a thermoplastic resin having a glass transition temperature of &#x2212;10&#xb0; C. to 20&#xb0; C.; a curing agent containing a phenol resin having a softening point of 70&#xb0; C. or more; a solid epoxy resin; and a liquid epoxy resin, wherein a weight ratio of the total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, an adhesive film for a semiconductor including the adhesive composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive composition for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Adhesive composition for semiconductor, adhesive film for semiconductor, and dicing die bonding film

The present invention relates to a pressure-sensitive adhesive composition, a protective film for polarizers, which includes a cured product of the pressure-sensitive adhesive composition, a polarizer, and a liquid crystal display (LCD). In the present invention, a pressure-sensitive adhesive showing excellent endurance reliability in high-temperature and/or high-humidity conditions and having superior physical properties such as cuttability, re-peeling property, and workability can be provided. In particular, it is possible to provide the pressure-sensitive adhesive composition which can prevent light leakage that may occur in an LCD, even when being applied to a film having a low stress optical coefficient.

Adhesive composition, protective film for a polarizing plate, polarizing plate, and liquid crystal display

There are provided a composition for forming an adhesive layer of a dicing film, including: a polymer additive including at least one polymer selected from the group consisting of a polymer containing a (meth)acrylate-based functional group and a non-polar functional group, a (meth)acrylate-based polymer containing at least one fluorine, and a silicon-modified (meth)acrylate-based polymer containing a reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the polymer additive to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film.

Composition for forming adhesive layer of dicing film, and dicing film

The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of: applying a voltage to the polymer film at a temperature of 5&#xb0; C. to 250&#xb0; C., while one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.

Method for measuring metal ion permeability of polymer film and device for measuring metal ion permeability of polymer film

The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of applying a voltage to the polymer film, while at least one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.

The present invention relates to a semiconductor device including: a first semiconductor element fixed onto an adherend by flip-chip connection; an adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element; and a second semiconductor element connected to the first semiconductor element via the adhesive layer, wherein the adhesive layer has a predetermined melt viscosity and thixotropic index.

Semiconductor device and method for manufacturing the same using an adhesive

A swelling tape for filling a gap, a method of manufacturing the swelling tape for filling a gap, a method of filling a gap, an electrode assembly and a secondary battery are provided. For example, the swelling tape can be applied inside a gap in which a fluid exists so as to fill the gap by becoming a 3D form, and can be useful at anchoring a subject in which the gap is formed, as necessary.

Swelling tape for filling gap

The present invention relates to an adhesive resin composition for bonding semiconductors, including: a (meth)acrylate-based resin including more than 17% by weight of (meth)acrylate-based repeating units containing epoxy-based functional groups; an epoxy resin having a softening point of more than 70&#xb0; C.; and a phenol resin having a softening point of more than 105&#xb0; C., wherein the weight ratio of the (meth)acrylate-based resin is 0.48 to 0.65 relative to the total weight of the (meth)acrylate-based resin, the epoxy resin, and the phenol resin, an adhesive film for semiconductors obtained from the resin composition, a dicing die-bonding film including an adhesive layer that includes the adhesive film for semiconductors, a semiconductor wafer including the dicing die-bonding film, and a dicing method for the semiconductor wafer using the dicing die-bonding film.

Adhesive resin compostition for bonding semiconductors and adhesive film for semiconductors

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Daejeon, South Korea

Se Ra Kim