Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Se Min Jin

Seung Goo Jang

Eun Kyoung Kim

Hyung Geun Ji

Tae Hee Lee

Tae Hyun Kim

Sung Bo Oh

Jung Hyun Lim

Min Hoon Kim

Ho Shin Lee

Young Taek Yoo

Song Ki Cho

Yu Whan Kwak

Hong Gyu Han

Jae Hyun Chang

Sang Hyun Kim

Won Cheol Lee

An antenna apparatus includes a patch antenna pattern; a feed via electrically connected to the patch antenna pattern at a point offset in a first direction from a center of the patch antenna pattern; a first side coupling pattern spaced apart from the patch antenna pattern along a second direction and a second side coupling pattern spaced apart from the patch antenna pattern along the second direction and opposite to the first side coupling pattern; and a first side ground pattern spaced apart from the patch antenna pattern along the first direction and a second side ground pattern spaced apart from the patch antenna pattern along the first direction and opposite to the first side ground pattern. The patch antenna pattern and the first and second side coupling patterns are disposed between the first and second side ground patterns with respect to the first direction.

Antenna apparatus

Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.

Mounting module and antenna apparatus

A semiconductor package includes a substrate including an antenna; a heating element disposed on a first surface of the substrate and connected to the antenna; a heat radiating part coupled to the heating element; and a signal transfer part disposed on the first surface of the substrate and configured to electrically connect the substrate to a main substrate. The heat radiating part may include a heat transfer part connected to the heating element and heat radiating terminals connecting the heat transfer part and the main substrate to each other.

Semiconductor package and electronic device having the same

An image display system and a display method thereof are provided. The image display system includes an optical disc having image information thereon, an image display device having extended display identification data (EDID), and a reproduction device to analyze the EDID to determine an interface to connect with the image display device, if the image information is three-dimensional (3D) image information, and instruct the image display device to output an alarm text, if the interface is an analog. When the interface is an analog interface, the reproduction device may output an analog two-dimensional (2D) image or 3D image through the image display device. Even when the image display device and the reproduction device are interconnected via an analog interfaces, a 2D or 3D image may be output based on the 3D image information.

Image display system and display method thereof

Growing community of inventors

Suwon-si, South Korea

Se Min Jin