Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology, Inc.

Kt Corporation

Se Man Oh

Kyoung Yeon Lee

Sang Hyeon Lee

Min Cheol Shin

Byong Jin Kim

Corey Reichman

Tae Yong Lee

Seung Mo Kim

Min Chul Shin

Chang Hun Kim

Young Kwan Kwon

Seung Tak Oh

Ju Hwan Jeong

Sang Youb Lee

Gyu Kweon Han

Jung Hwa Kim

A semiconductor device includes a substrate including a conductive transceiver pattern proximate to the substrate top side. An antenna structure includes an antenna dielectric structure coupled to the substrate top side, an antenna conductive structure having an antenna element, and a cavity below the antenna element. The antenna element overlies the conductive transceiver pattern. The cavity includes a cavity ceiling, a cavity base, and a cavity sidewall. Either a bottom surface of the antenna element defines the cavity ceiling and a perimeter portion of the antenna element is fixed to the antenna dielectric structure, or the antenna dielectric structure includes a body portion having a bottom surface that defines the cavity ceiling and the antenna element is vertically spaced apart from the bottom surface of the body portion. A semiconductor component is coupled to the substrate bottom side and the transceiver pattern.

Semiconductor devices and methods of manufacturing semiconductor devices

In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Semiconductor device and a method of manufacturing a semiconductor device

In one example, a semiconductor device, includes a substrate having a substrate top side, a substrate bottom side, a substrate dielectric structure, and a substrate conductive structure. The substrate conductive structure includes a transceiver pattern proximate to a substrate top side. An antenna structure includes an antenna dielectric structure coupled to the substrate top side, an antenna conductive structure having an antenna element, and a cavity below the antenna element. The antenna element overlies the transceiver pattern. The cavity includes a cavity ceiling, a cavity base, and a cavity sidewall between the cavity ceiling and the cavity base. Either a bottom surface of the antenna element defines the cavity ceiling and a perimeter portion of the antenna element is fixed to the antenna dielectric structure, or the antenna dielectric structure includes a body portion having a bottom surface that defines the cavity ceiling and the antenna element is vertically spaced apart from the bottom surface of the body portion. An semiconductor component is coupled to a bottom side of the substrate and is coupled to the transceiver pattern. Other examples and related methods are also disclosed herein.

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a substrate comprising a dielectric layer and a wiring pattern embedded in and exposed from the dielectric layer.

Finger print sensor and manufacturing method thereof

Provided are a semiconductor package and a manufacturing method thereof for securing a space for mounting a semiconductor device by etching a temporary metal plate to form a plurality of conductive posts.

Semiconductor package and manufacturing method thereof

A method for dealing with attacks of malicious BOTs in a network security system includes detecting and analyzing a domain name receiving excessive DNS queries to judge the infection of a malicious BOT, registering the corresponding domain name as normal or abnormal management target, and redirecting an abnormal DNS query for the abnormal management target to a redirection processing & response system. Thereby, the automatic detection of malicious BOT attacks and the mechanism which performs the measures and the analysis simultaneously can protect the DNS servers and prevent the security accidents by malicious BOT attacks previously.

Malignant BOT confrontation method and its system

Growing community of inventors

Seoul, South Korea

Se Man Oh