K. C. Tech Co., Ltd.

Se-Jong Ko

Cheol-Nam Yoon

Jung-Gwan Kim

Jeong-Ho Lee

The invention concerns an apparatus for cleaning the edge of a wafer that may be relatively simply constructed with low cost, and prevent the wafer from being re-contaminated by the edge cleaning, thus resulting in increase of the yield rate of wafers. The apparatus includes a cleaning agent ejection nozzle body provided on a side part of a chuck for ejecting a particulate cleaning agent (COparticles) towards the side and the edge portions of the wafer held and rotated by the chuck, and a nozzle body carriage for moving the nozzle body between rest and cleaning positions.

Apparatus for cleaning the edges of wafers

Disclosed is a nozzle for injecting sublimable solid particles, which is capable of minimizing consumption of the carrier gas and also maximizing cleaning efficiency. The nozzle comprises a base block having a space in which carrier gas is supplied through a gas supplying pipe; a sub-block having a space in which cleaning medium decompressed by a regulator is supplied through a cleaning medium supplying pipe; a first venturi block having a venturi path for adiabatically expanding the carrier gas supplied from the space of the base block, and a cleaning medium injection path communicating the venturi path and the space of the sub-block and the carrier gas passed through the venturi path; and a second venturi block having a venturi path for adiabatically expanding the mixed gas of the carrier gas and the cleaning medium.

Growing community of inventors

Pyeongtaek-shi, South Korea

Se-Jong Ko