Samsung Electronics Co., Ltd.

Se-Jin Yoo

Praveen Gulaka

Won-Gil Han

Hyun-hee Jo

Hong-Sub Joo

Yang-lim Choi

Sung-Il Cho

Jae-Moon Jo

Jae-ho Choi

Jin-wook Jang

In a method of manufacturing a semiconductor package, a first semiconductor device is arranged on a package substrate. An electrostatic discharge structure is formed on at least one ground substrate pad exposed from an upper surface of the package substrate. A plurality of second semiconductor devices is stacked on the package substrate and spaced apart from the first semiconductor device, the electrostatic discharge structure being interposed between the first semiconductor device and the plurality of second semiconductor devices. A molding member is formed on the package substrate to cover the first semiconductor device and the plurality of second semiconductor devices.

Semiconductor package

Method of manufacturing a semiconductor package

A medical image processing apparatus and method are provided. The medical image processing apparatus includes a controller configured to acquire an icon based on information in a medical image file of an object, the icon having a shape of the object and comprising one or more sub-icons, and a display configured to display the icon. Each of the one or more sub-icons corresponds to an anatomical region of the object is configured to accept input to perform one or more image processing functions associated with the corresponding anatomical region.

Medical image processing apparatus and method

Disclosed are a method for processing a magnetic resonance (MR) image of a dynamic object and an MRI apparatus. The method includes receiving, from the dynamic object, a plurality of MR signals that correspond to a plurality of time sections and a plurality of slices, generating a plurality of MR images by using the plurality of MR signals, performing segmentation of each of the plurality of MR images into a plurality of regions, determining whether a segmentation error occurs in each of the plurality of MR images, and arranging the plurality of MR images to correspond to the respective time sections and the respective slices to display a matrix image, based on a result of the determining.

Magnetic resonance imaging apparatus and magnetic resonance image processing method

A semiconductor package includes a wiring substrate including a plurality of solder pads; a chip including a plurality of chip pads connected to the solder pads through a plurality of solders; a sealing layer configured to seal the chip and the solders, at least one void being between the solders; and a solder extrusion prevention layer on one sidewall of the solder exposed by the at least one void.

Semiconductor package and method of manufacturing the same

Growing community of inventors

Asan-si, South Korea

Se-Jin Yoo