Lg Chem, Ltd

Se Jin Shin

Sang Woo Kim

Kyung Jun Kim

Dong Hyun Oh

Chan Hyo Park

Hye Ran Seong

Kyoung Ho Ahn

Jung Ho Jo

Hye Won Jeong

Yu Na Kim

In a method for preparing a polyimide resin by reacting diamine and dianhydride, the polyimide resin is polymerized under the presence of a solvent having a boiling point ranging from 130&#xb0; C. to 180&#xb0; C. so as to be curable at a low temperature ranging from 150&#xb0; C. to 250&#xb0; C. Because the polyimide is curable even at a low temperature, when the polyimide resin is used as an electronic material, damage to equipment due to an otherwise high temperature process can be minimized, and in addition, the polyimide resin can be extensively used as an electronic material such as for a plastic substrate, or the like.

Low temperature curable polyimide resin and method of preparing the same

Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

Polyimide-based polymers, copolymers thereof and positive type photoresist compositions comprising the same

The present invention relates to polyimide or precursor thereof represented by Chemical Formula 1 or 2 and a photosensitive resin composition including the same. The polyimide or precursor thereof are fabricated using diamine comprising polyalkyleneoxide. The photosensitive resin composition of the present invention has excellent light transmissivity, an excellent resolution, and excellent photo sensitivity and image forming performance. Further, the photosensitive resin composition has high adhesiveness with substrates, such as a silicon film, a silicon oxide film, and a metal film. In particular, an excellent film without failure, such as crack, can be formed.

Photosensitive polyimide and photosensitive resin composition comprising the same

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Daejeon, Kuwait

Se Jin Shin