Samsung Electronics Co., Ltd.

Lms Co., Ltd.

Other

Se Jin Oh

Jee Hong Min

Doug Yong Sung

Yun Kwang Jeon

Kul Inn

Sung Ho Jang

Ki Ho Hwang

Dong Cheol Lee

Protopopov Vladimir

Tae Hyun Kim

Min Ho Kim

Jeng H Hwang

Sang Ki Nam

Young Il Kim

Tae Jun Lee

Woo Jong Lee

Ki Wook Lee

Jae Ho Jang

Byeong Cheol Kim

Byoung Hun Lee

Doo Young Gwak

Chan Ouk Jung

Jin Yeon Choi

Jin Kyou Choi

Chan Bin Mo

Du Yi Kim

Seung Bin Ahn

Ju Hyuk Yim

Ha Young Jang

Yong Deuk Ko

Jae Ik Kim

Yu Sin Kim

Ji Yeon Hong

Tae Kyun Kang

A spectroscopic analysis method having improved accuracy and correlation, a method for fabricating a semiconductor device using the same, and a substrate process system using the same are provided. The spectroscopic analysis method includes receiving plasma light emitted from plasma to generate an emission spectrum, detecting n (here, n is a natural number of 2 or more) peak wavelengths from the emission spectrum, generating a plurality of correlation factor time series from correlation factors between the peak wavelengths, filtering the plurality of correlation factor time series, and analyzing the plasma, using the filtered correlation factor time series.

Spectroscopic analysis method, method for fabricating semiconductor device using the same, and substrate process system using the same

The present invention provides a backlight module comprising a light emitting unit including a light source and a light guide plate transmitting light from the light source; a light guide unit accumulatively placed on the top of the light emitting unit and transmitting the light to the upper part of the light guide unit; a mold frame containing the light emitting unit and the light guide unit and having a space between the side of the light guide unit and the mold frame; and a shielding portion formed at the side of the light guide unit to prevent light leakage transmitting from the side of the light guide unit to the outside of the light guide unit.

Light guide unit having shielding portion, backlight module using the same and manufacturing method of light guide unit

The present invention provides an integrated optical sheet module where an optical sheet is integrally formed without a diffusion sheet, a condensing sheet and a reflective polarizing sheet thereby reducing the overall thickness and improving the viewing angle, so that a manufacturing process can be simplified and significantly improve the left to right viewing angle while minimizing the brightness drop by forming the first base film having the viewing angle improvement component on the bottom surface with a haze characteristic.

Integrated optical sheet module and backlight unit having same

The present disclosure relates to an optical sheet having improved optical properties and minimized surface spots. According to one aspect of the present disclosure, provided is an optical sheet comprising: a first prism sheet which has a plurality of prisms parallel in a first direction formed on one surface thereof; and a diffusion sheet which is positioned at the surface side into which light of the first prism sheet is incident and has a plurality of protrusions formed on the surface facing the first prism sheet.

Optical sheet and backlight unit having same

An apparatus for monitoring an interior of a process chamber including a process chamber including a chamber body and a view port defined in the chamber body, a cover section including a pinhole in one end, the cover section disposed to correspond to an end portion of the view port, the cover section having a first length in a direction toward a center point of the process chamber, and a sensing unit inserted into the view port to monitor the interior of the process chamber through the pinhole, a region in the process chamber to be sensed by the sensing unit determined based on the first length may be provided.

Apparatus for monitoring process chamber

A semiconductor substrate measuring apparatus includes a light source unit generating irradiation light including light in a first wavelength band and light in a second wavelength band. An optical unit irradiates the irradiation light on a measurement object and condenses reflected light. A light splitting unit splits the reflected light, condensed in the optical unit, into a first optical path and a second optical path. A first detecting unit is disposed on the first optical path and detects first interference light in the first wavelength band in the reflected light. A second detecting unit is disposed on the second optical path and detects second interference light in the second wavelength band in the reflected light. A controlling unit calculates at least one of a surface shape or a thickness of the measurement object. The controlling unit calculates a temperature of the measurement object.

Semiconductor substrate measuring apparatus and plasma treatment apparatus using the same

Contaminants are generated during etching processes for forming electrodes of storage capacitors for very high density future memory cells, such as ferroelectric random access memory (FeRAM) cells. These contaminants include significant quantities of noble metals, and in particular iridium and iridium compound particulates. In order to prevent undesirable iridium and iridium compound particulates from adversely affecting subsequent etching processes performed in the chamber, the plasma metal etch chamber is seasoned by exposing interior surfaces of the chamber to a seasoning plasma generated from a gas mixture comprising at least two gases selected from the group consisting of BCl , HBr, and CF . The chamber seasoning method of the invention is also applicable to etch processes involving other noble metals, such as platinum.

Method of reducing particulates in a plasma etch chamber during a metal etch process

Growing community of inventors

Hwaseong-si, South Korea

Se Jin Oh